▶ 調査レポート

周辺機器相互接続バスの世界市場2023年:32ビット 33MHz、32ビット 66MHz、64ビット 33MHz、64ビット 66MHz

• 英文タイトル:Global Peripheral Component Interconnect Bus Market Research Report 2023

Global Peripheral Component Interconnect Bus Market Research Report 2023「周辺機器相互接続バスの世界市場2023年:32ビット 33MHz、32ビット 66MHz、64ビット 33MHz、64ビット 66MHz」(市場規模、市場予測)調査レポートです。• レポートコード:MRC23Q33951
• 出版社/出版日:QYResearch / 2023年3月
• レポート形態:英文、PDF、90ページ
• 納品方法:Eメール(2-3日)
• 産業分類:IT&通信
• 販売価格(消費税別)
  Single User¥406,000 (USD2,900)▷ お問い合わせ
  Enterprise License¥812,000 (USD5,800)▷ お問い合わせ
• ご注文方法:お問い合わせフォーム記入又はEメールでご連絡ください。
• お支払方法:銀行振込(納品後、ご請求書送付)
レポート概要
本調査レポートは世界の周辺機器相互接続バス市場について調査・分析し、世界の周辺機器相互接続バス市場概要、メーカー別競争状況、地域別生産量、地域別消費量、タイプ別セグメント分析(32ビット 33MHz、32ビット 66MHz、64ビット 33MHz、64ビット 66MHz)、用途別セグメント分析(通信、インフラ、住宅、工業、その他)、主要企業のプロファイル、市場動向などに関する情報を掲載しています。主要企業としては、Intel Corporation、Texas Instrument、Microchip Technology、Samsung Electronics、Nvidia、NXP Semicondutors、Semtech、Renesas Electronics Corporationなどが含まれています。
世界の周辺機器相互接続バス市場は、2022年にXXX米ドル、2029年にはXXX米ドルに達すると予測され、予測期間中の年平均成長率はXXX%です。COVID-19とロシア・ウクライナ戦争による影響は、周辺機器相互接続バス市場規模を推定する際に考慮しました。本レポートは、周辺機器相互接続バスの世界市場を定量的・定性的な分析により包括的に提示し、読者がビジネス/成長戦略を策定し、市場競争状況を把握し、現在の市場における自社のポジションを分析し、周辺機器相互接続バスに関するビジネス上の意思決定に役立てることを目的としています。

・周辺機器相互接続バス市場の概要
- 製品の定義
- 周辺機器相互接続バスのタイプ別セグメント
- 世界の周辺機器相互接続バス市場成長率のタイプ別分析(32ビット 33MHz、32ビット 66MHz、64ビット 33MHz、64ビット 66MHz)
- 周辺機器相互接続バスの用途別セグメント
- 世界の周辺機器相互接続バス市場成長率の用途別分析(通信、インフラ、住宅、工業、その他)
- 世界市場の成長展望
- 世界の周辺機器相互接続バス生産量の推定と予測(2018年-2029年)
- 世界の周辺機器相互接続バス生産能力の推定と予測(2018年-2029年)
- 周辺機器相互接続バスの平均価格の推定と予測(2018年-2029年)
- 前提条件と制限事項

・メーカー別競争状況
- メーカー別市場シェア
- 世界の主要メーカー、業界ランキング分析
- メーカー別平均価格
- 周辺機器相互接続バス市場の競争状況およびトレンド

・周辺機器相互接続バスの地域別生産量
- 周辺機器相互接続バス生産量の地域別推計と予測(2018年-2029年)
- 地域別周辺機器相互接続バス価格分析(2018年-2023年)
- 北米の周辺機器相互接続バス生産規模(2018年-2029年)
- ヨーロッパの周辺機器相互接続バス生産規模(2018年-2029年)
- 中国の周辺機器相互接続バス生産規模(2018年-2029年)
- 日本の周辺機器相互接続バス生産規模(2018年-2029年)
- 韓国の周辺機器相互接続バス生産規模(2018年-2029年)
- インドの周辺機器相互接続バス生産規模(2018年-2029年)

・周辺機器相互接続バスの地域別消費量
- 周辺機器相互接続バス消費量の地域別推計と予測(2018年-2029年)
- 北米の周辺機器相互接続バス消費量(2018年-2029年)
- アメリカの周辺機器相互接続バス消費量(2018年-2029年)
- ヨーロッパの周辺機器相互接続バス消費量(2018年-2029年)
- アジア太平洋の周辺機器相互接続バス消費量(2018年-2029年)
- 中国の周辺機器相互接続バス消費量(2018年-2029年)
- 日本の周辺機器相互接続バス消費量(2018年-2029年)
- 韓国の周辺機器相互接続バス消費量(2018年-2029年)
- 東南アジアの周辺機器相互接続バス消費量(2018年-2029年)
- インドの周辺機器相互接続バス消費量(2018年-2029年)
- 中南米・中東・アフリカの周辺機器相互接続バス消費量(2018年-2029年)

・タイプ別セグメント:32ビット 33MHz、32ビット 66MHz、64ビット 33MHz、64ビット 66MHz
- 世界の周辺機器相互接続バスのタイプ別生産量(2018年-2023年)
- 世界の周辺機器相互接続バスのタイプ別生産量(2024年-2029年)
- 世界の周辺機器相互接続バスのタイプ別価格

・用途別セグメント:通信、インフラ、住宅、工業、その他
- 世界の周辺機器相互接続バスの用途別生産量(2018年-2023年)
- 世界の周辺機器相互接続バスの用途別生産量(2024年-2029年)
- 世界の周辺機器相互接続バスの用途別価格

・主要企業のプロファイル:企業情報、製品ポートフォリオ、生産量、価格、動向
Intel Corporation、Texas Instrument、Microchip Technology、Samsung Electronics、Nvidia、NXP Semicondutors、Semtech、Renesas Electronics Corporation

・産業チェーンと販売チャネルの分析
- 周辺機器相互接続バス産業チェーン分析
- 周辺機器相互接続バスの主要原材料
- 周辺機器相互接続バスの販売チャネル
- 周辺機器相互接続バスのディストリビューター
- 周辺機器相互接続バスの主要顧客

・周辺機器相互接続バス市場ダイナミクス
- 周辺機器相互接続バスの業界動向
- 周辺機器相互接続バス市場の成長ドライバ、課題、阻害要因

・調査成果および結論

・調査方法とデータソース

The global Peripheral Component Interconnect Bus market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Peripheral Component Interconnect Bus is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Peripheral Component Interconnect Bus is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Peripheral Component Interconnect Bus include Intel Corporation, Texas Instrument, Microchip Technology, Samsung Electronics, Nvidia, NXP Semicondutors, Semtech and Renesas Electronics Corporation, etc. In 2022, the world’s top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Peripheral Component Interconnect Bus, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Peripheral Component Interconnect Bus.
The Peripheral Component Interconnect Bus market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Peripheral Component Interconnect Bus market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Peripheral Component Interconnect Bus manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Intel Corporation
Texas Instrument
Microchip Technology
Samsung Electronics
Nvidia
NXP Semicondutors
Semtech
Renesas Electronics Corporation
Segment by Type
32-bit 33MHz
32-bit 66MHz
64-bit 33MHz
64-bit 66MHz
Segment by Application
Telecom
Infrastructure
Residential
Industrial
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Peripheral Component Interconnect Bus manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Peripheral Component Interconnect Bus by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Peripheral Component Interconnect Bus in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

レポート目次

1 Peripheral Component Interconnect Bus Market Overview
1.1 Product Definition
1.2 Peripheral Component Interconnect Bus Segment by Type
1.2.1 Global Peripheral Component Interconnect Bus Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 32-bit 33MHz
1.2.3 32-bit 66MHz
1.2.4 64-bit 33MHz
1.2.5 64-bit 66MHz
1.3 Peripheral Component Interconnect Bus Segment by Application
1.3.1 Global Peripheral Component Interconnect Bus Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Telecom
1.3.3 Infrastructure
1.3.4 Residential
1.3.5 Industrial
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Peripheral Component Interconnect Bus Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Peripheral Component Interconnect Bus Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Peripheral Component Interconnect Bus Production Estimates and Forecasts (2018-2029)
1.4.4 Global Peripheral Component Interconnect Bus Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Peripheral Component Interconnect Bus Production Market Share by Manufacturers (2018-2023)
2.2 Global Peripheral Component Interconnect Bus Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Peripheral Component Interconnect Bus, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Peripheral Component Interconnect Bus Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Peripheral Component Interconnect Bus Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Peripheral Component Interconnect Bus, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Peripheral Component Interconnect Bus, Product Offered and Application
2.8 Global Key Manufacturers of Peripheral Component Interconnect Bus, Date of Enter into This Industry
2.9 Peripheral Component Interconnect Bus Market Competitive Situation and Trends
2.9.1 Peripheral Component Interconnect Bus Market Concentration Rate
2.9.2 Global 5 and 10 Largest Peripheral Component Interconnect Bus Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Peripheral Component Interconnect Bus Production by Region
3.1 Global Peripheral Component Interconnect Bus Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Peripheral Component Interconnect Bus Production Value by Region (2018-2029)
3.2.1 Global Peripheral Component Interconnect Bus Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Peripheral Component Interconnect Bus by Region (2024-2029)
3.3 Global Peripheral Component Interconnect Bus Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Peripheral Component Interconnect Bus Production by Region (2018-2029)
3.4.1 Global Peripheral Component Interconnect Bus Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Peripheral Component Interconnect Bus by Region (2024-2029)
3.5 Global Peripheral Component Interconnect Bus Market Price Analysis by Region (2018-2023)
3.6 Global Peripheral Component Interconnect Bus Production and Value, Year-over-Year Growth
3.6.1 North America Peripheral Component Interconnect Bus Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Peripheral Component Interconnect Bus Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Peripheral Component Interconnect Bus Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Peripheral Component Interconnect Bus Production Value Estimates and Forecasts (2018-2029)
4 Peripheral Component Interconnect Bus Consumption by Region
4.1 Global Peripheral Component Interconnect Bus Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Peripheral Component Interconnect Bus Consumption by Region (2018-2029)
4.2.1 Global Peripheral Component Interconnect Bus Consumption by Region (2018-2023)
4.2.2 Global Peripheral Component Interconnect Bus Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Peripheral Component Interconnect Bus Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Peripheral Component Interconnect Bus Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Peripheral Component Interconnect Bus Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Peripheral Component Interconnect Bus Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Peripheral Component Interconnect Bus Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Peripheral Component Interconnect Bus Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Peripheral Component Interconnect Bus Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Peripheral Component Interconnect Bus Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Peripheral Component Interconnect Bus Production by Type (2018-2029)
5.1.1 Global Peripheral Component Interconnect Bus Production by Type (2018-2023)
5.1.2 Global Peripheral Component Interconnect Bus Production by Type (2024-2029)
5.1.3 Global Peripheral Component Interconnect Bus Production Market Share by Type (2018-2029)
5.2 Global Peripheral Component Interconnect Bus Production Value by Type (2018-2029)
5.2.1 Global Peripheral Component Interconnect Bus Production Value by Type (2018-2023)
5.2.2 Global Peripheral Component Interconnect Bus Production Value by Type (2024-2029)
5.2.3 Global Peripheral Component Interconnect Bus Production Value Market Share by Type (2018-2029)
5.3 Global Peripheral Component Interconnect Bus Price by Type (2018-2029)
6 Segment by Application
6.1 Global Peripheral Component Interconnect Bus Production by Application (2018-2029)
6.1.1 Global Peripheral Component Interconnect Bus Production by Application (2018-2023)
6.1.2 Global Peripheral Component Interconnect Bus Production by Application (2024-2029)
6.1.3 Global Peripheral Component Interconnect Bus Production Market Share by Application (2018-2029)
6.2 Global Peripheral Component Interconnect Bus Production Value by Application (2018-2029)
6.2.1 Global Peripheral Component Interconnect Bus Production Value by Application (2018-2023)
6.2.2 Global Peripheral Component Interconnect Bus Production Value by Application (2024-2029)
6.2.3 Global Peripheral Component Interconnect Bus Production Value Market Share by Application (2018-2029)
6.3 Global Peripheral Component Interconnect Bus Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Intel Corporation
7.1.1 Intel Corporation Peripheral Component Interconnect Bus Corporation Information
7.1.2 Intel Corporation Peripheral Component Interconnect Bus Product Portfolio
7.1.3 Intel Corporation Peripheral Component Interconnect Bus Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Intel Corporation Main Business and Markets Served
7.1.5 Intel Corporation Recent Developments/Updates
7.2 Texas Instrument
7.2.1 Texas Instrument Peripheral Component Interconnect Bus Corporation Information
7.2.2 Texas Instrument Peripheral Component Interconnect Bus Product Portfolio
7.2.3 Texas Instrument Peripheral Component Interconnect Bus Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Texas Instrument Main Business and Markets Served
7.2.5 Texas Instrument Recent Developments/Updates
7.3 Microchip Technology
7.3.1 Microchip Technology Peripheral Component Interconnect Bus Corporation Information
7.3.2 Microchip Technology Peripheral Component Interconnect Bus Product Portfolio
7.3.3 Microchip Technology Peripheral Component Interconnect Bus Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Microchip Technology Main Business and Markets Served
7.3.5 Microchip Technology Recent Developments/Updates
7.4 Samsung Electronics
7.4.1 Samsung Electronics Peripheral Component Interconnect Bus Corporation Information
7.4.2 Samsung Electronics Peripheral Component Interconnect Bus Product Portfolio
7.4.3 Samsung Electronics Peripheral Component Interconnect Bus Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Samsung Electronics Main Business and Markets Served
7.4.5 Samsung Electronics Recent Developments/Updates
7.5 Nvidia
7.5.1 Nvidia Peripheral Component Interconnect Bus Corporation Information
7.5.2 Nvidia Peripheral Component Interconnect Bus Product Portfolio
7.5.3 Nvidia Peripheral Component Interconnect Bus Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Nvidia Main Business and Markets Served
7.5.5 Nvidia Recent Developments/Updates
7.6 NXP Semicondutors
7.6.1 NXP Semicondutors Peripheral Component Interconnect Bus Corporation Information
7.6.2 NXP Semicondutors Peripheral Component Interconnect Bus Product Portfolio
7.6.3 NXP Semicondutors Peripheral Component Interconnect Bus Production, Value, Price and Gross Margin (2018-2023)
7.6.4 NXP Semicondutors Main Business and Markets Served
7.6.5 NXP Semicondutors Recent Developments/Updates
7.7 Semtech
7.7.1 Semtech Peripheral Component Interconnect Bus Corporation Information
7.7.2 Semtech Peripheral Component Interconnect Bus Product Portfolio
7.7.3 Semtech Peripheral Component Interconnect Bus Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Semtech Main Business and Markets Served
7.7.5 Semtech Recent Developments/Updates
7.8 Renesas Electronics Corporation
7.8.1 Renesas Electronics Corporation Peripheral Component Interconnect Bus Corporation Information
7.8.2 Renesas Electronics Corporation Peripheral Component Interconnect Bus Product Portfolio
7.8.3 Renesas Electronics Corporation Peripheral Component Interconnect Bus Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Renesas Electronics Corporation Main Business and Markets Served
7.7.5 Renesas Electronics Corporation Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Peripheral Component Interconnect Bus Industry Chain Analysis
8.2 Peripheral Component Interconnect Bus Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Peripheral Component Interconnect Bus Production Mode & Process
8.4 Peripheral Component Interconnect Bus Sales and Marketing
8.4.1 Peripheral Component Interconnect Bus Sales Channels
8.4.2 Peripheral Component Interconnect Bus Distributors
8.5 Peripheral Component Interconnect Bus Customers
9 Peripheral Component Interconnect Bus Market Dynamics
9.1 Peripheral Component Interconnect Bus Industry Trends
9.2 Peripheral Component Interconnect Bus Market Drivers
9.3 Peripheral Component Interconnect Bus Market Challenges
9.4 Peripheral Component Interconnect Bus Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer