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レポート概要
| 本調査レポートは世界の全自動半導体成型装置市場について調査・分析し、世界の全自動半導体成型装置市場概要、メーカー別競争状況、地域別生産量、地域別消費量、タイプ別セグメント分析（油圧式半導体成型装置、電気式半導体成型装置）、用途別セグメント分析（ウェーハレベルパッケージング、BGAパッケージング、フラットパネルパッケージング、その他）、主要企業のプロファイル、市場動向などに関する情報を掲載しています。主要企業としては、TOWA、ASMPT、Besi、I-PEX、Yamada、TAKARA TOOL & DIE、Asahi Engineering、Tongling Fushi Sanjia、Nextool Technology、DAHUA Technologyなどが含まれています。 世界の全自動半導体成型装置市場は、2022年にXXX米ドル、2029年にはXXX米ドルに達すると予測され、予測期間中の年平均成長率はXXX％です。COVID-19とロシア・ウクライナ戦争による影響は、全自動半導体成型装置市場規模を推定する際に考慮しました。本レポートは、全自動半導体成型装置の世界市場を定量的・定性的な分析により包括的に提示し、読者がビジネス/成長戦略を策定し、市場競争状況を把握し、現在の市場における自社のポジションを分析し、全自動半導体成型装置に関するビジネス上の意思決定に役立てることを目的としています。 ・全自動半導体成型装置市場の概要 - 製品の定義 - 全自動半導体成型装置のタイプ別セグメント - 世界の全自動半導体成型装置市場成長率のタイプ別分析（油圧式半導体成型装置、電気式半導体成型装置） - 全自動半導体成型装置の用途別セグメント - 世界の全自動半導体成型装置市場成長率の用途別分析（ウェーハレベルパッケージング、BGAパッケージング、フラットパネルパッケージング、その他） - 世界市場の成長展望 - 世界の全自動半導体成型装置生産量の推定と予測（2018年-2029年） - 世界の全自動半導体成型装置生産能力の推定と予測（2018年-2029年） - 全自動半導体成型装置の平均価格の推定と予測（2018年-2029年） - 前提条件と制限事項 ・メーカー別競争状況 - メーカー別市場シェア - 世界の主要メーカー、業界ランキング分析 - メーカー別平均価格 - 全自動半導体成型装置市場の競争状況およびトレンド ・全自動半導体成型装置の地域別生産量 - 全自動半導体成型装置生産量の地域別推計と予測（2018年-2029年） - 地域別全自動半導体成型装置価格分析（2018年-2023年） - 北米の全自動半導体成型装置生産規模（2018年-2029年） - ヨーロッパの全自動半導体成型装置生産規模（2018年-2029年） - 中国の全自動半導体成型装置生産規模（2018年-2029年） - 日本の全自動半導体成型装置生産規模（2018年-2029年） - 韓国の全自動半導体成型装置生産規模（2018年-2029年） - インドの全自動半導体成型装置生産規模（2018年-2029年） ・全自動半導体成型装置の地域別消費量 - 全自動半導体成型装置消費量の地域別推計と予測（2018年-2029年） - 北米の全自動半導体成型装置消費量（2018年-2029年） - アメリカの全自動半導体成型装置消費量（2018年-2029年） - ヨーロッパの全自動半導体成型装置消費量（2018年-2029年） - アジア太平洋の全自動半導体成型装置消費量（2018年-2029年） - 中国の全自動半導体成型装置消費量（2018年-2029年） - 日本の全自動半導体成型装置消費量（2018年-2029年） - 韓国の全自動半導体成型装置消費量（2018年-2029年） - 東南アジアの全自動半導体成型装置消費量（2018年-2029年） - インドの全自動半導体成型装置消費量（2018年-2029年） - 中南米・中東・アフリカの全自動半導体成型装置消費量（2018年-2029年） ・タイプ別セグメント：油圧式半導体成型装置、電気式半導体成型装置 - 世界の全自動半導体成型装置のタイプ別生産量（2018年-2023年） - 世界の全自動半導体成型装置のタイプ別生産量（2024年-2029年） - 世界の全自動半導体成型装置のタイプ別価格 ・用途別セグメント：ウェーハレベルパッケージング、BGAパッケージング、フラットパネルパッケージング、その他 - 世界の全自動半導体成型装置の用途別生産量（2018年-2023年） - 世界の全自動半導体成型装置の用途別生産量（2024年-2029年） - 世界の全自動半導体成型装置の用途別価格 ・主要企業のプロファイル：企業情報、製品ポートフォリオ、生産量、価格、動向 TOWA、ASMPT、Besi、I-PEX、Yamada、TAKARA TOOL & DIE、Asahi Engineering、Tongling Fushi Sanjia、Nextool Technology、DAHUA Technology ・産業チェーンと販売チャネルの分析 - 全自動半導体成型装置産業チェーン分析 - 全自動半導体成型装置の主要原材料 - 全自動半導体成型装置の販売チャネル - 全自動半導体成型装置のディストリビューター - 全自動半導体成型装置の主要顧客 ・全自動半導体成型装置市場ダイナミクス - 全自動半導体成型装置の業界動向 - 全自動半導体成型装置市場の成長ドライバ、課題、阻害要因 ・調査成果および結論 ・調査方法とデータソース |
The global Fully Automatic Semiconductor Molding Equipment market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Fully Automatic Semiconductor Molding Equipment is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Fully Automatic Semiconductor Molding Equipment is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Fully Automatic Semiconductor Molding Equipment include TOWA, ASMPT, Besi, I-PEX, Yamada, TAKARA TOOL & DIE, Asahi Engineering, Tongling Fushi Sanjia and Nextool Technology, etc. In 2022, the world’s top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Fully Automatic Semiconductor Molding Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Fully Automatic Semiconductor Molding Equipment.
The Fully Automatic Semiconductor Molding Equipment market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Fully Automatic Semiconductor Molding Equipment market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Fully Automatic Semiconductor Molding Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
TOWA
ASMPT
Besi
I-PEX
Yamada
TAKARA TOOL & DIE
Asahi Engineering
Tongling Fushi Sanjia
Nextool Technology
DAHUA Technology
Segment by Type
Hydraulic Semiconductor Molding System
Electric Semiconductor Molding System
Segment by Application
Wafer Level Packaging
BGA Packaging
Flat Panel Packaging
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Fully Automatic Semiconductor Molding Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Fully Automatic Semiconductor Molding Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Fully Automatic Semiconductor Molding Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
1 Fully Automatic Semiconductor Molding Equipment Market Overview
1.1 Product Definition
1.2 Fully Automatic Semiconductor Molding Equipment Segment by Type
1.2.1 Global Fully Automatic Semiconductor Molding Equipment Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Hydraulic Semiconductor Molding System
1.2.3 Electric Semiconductor Molding System
1.3 Fully Automatic Semiconductor Molding Equipment Segment by Application
1.3.1 Global Fully Automatic Semiconductor Molding Equipment Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Wafer Level Packaging
1.3.3 BGA Packaging
1.3.4 Flat Panel Packaging
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Fully Automatic Semiconductor Molding Equipment Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Fully Automatic Semiconductor Molding Equipment Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Fully Automatic Semiconductor Molding Equipment Production Estimates and Forecasts (2018-2029)
1.4.4 Global Fully Automatic Semiconductor Molding Equipment Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Fully Automatic Semiconductor Molding Equipment Production Market Share by Manufacturers (2018-2023)
2.2 Global Fully Automatic Semiconductor Molding Equipment Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Fully Automatic Semiconductor Molding Equipment, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Fully Automatic Semiconductor Molding Equipment Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Fully Automatic Semiconductor Molding Equipment Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Fully Automatic Semiconductor Molding Equipment, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Fully Automatic Semiconductor Molding Equipment, Product Offered and Application
2.8 Global Key Manufacturers of Fully Automatic Semiconductor Molding Equipment, Date of Enter into This Industry
2.9 Fully Automatic Semiconductor Molding Equipment Market Competitive Situation and Trends
2.9.1 Fully Automatic Semiconductor Molding Equipment Market Concentration Rate
2.9.2 Global 5 and 10 Largest Fully Automatic Semiconductor Molding Equipment Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Fully Automatic Semiconductor Molding Equipment Production by Region
3.1 Global Fully Automatic Semiconductor Molding Equipment Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Fully Automatic Semiconductor Molding Equipment Production Value by Region (2018-2029)
3.2.1 Global Fully Automatic Semiconductor Molding Equipment Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Fully Automatic Semiconductor Molding Equipment by Region (2024-2029)
3.3 Global Fully Automatic Semiconductor Molding Equipment Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Fully Automatic Semiconductor Molding Equipment Production by Region (2018-2029)
3.4.1 Global Fully Automatic Semiconductor Molding Equipment Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Fully Automatic Semiconductor Molding Equipment by Region (2024-2029)
3.5 Global Fully Automatic Semiconductor Molding Equipment Market Price Analysis by Region (2018-2023)
3.6 Global Fully Automatic Semiconductor Molding Equipment Production and Value, Year-over-Year Growth
3.6.1 North America Fully Automatic Semiconductor Molding Equipment Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Fully Automatic Semiconductor Molding Equipment Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Fully Automatic Semiconductor Molding Equipment Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Fully Automatic Semiconductor Molding Equipment Production Value Estimates and Forecasts (2018-2029)
4 Fully Automatic Semiconductor Molding Equipment Consumption by Region
4.1 Global Fully Automatic Semiconductor Molding Equipment Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Fully Automatic Semiconductor Molding Equipment Consumption by Region (2018-2029)
4.2.1 Global Fully Automatic Semiconductor Molding Equipment Consumption by Region (2018-2023)
4.2.2 Global Fully Automatic Semiconductor Molding Equipment Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Fully Automatic Semiconductor Molding Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Fully Automatic Semiconductor Molding Equipment Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Fully Automatic Semiconductor Molding Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Fully Automatic Semiconductor Molding Equipment Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Fully Automatic Semiconductor Molding Equipment Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Fully Automatic Semiconductor Molding Equipment Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Fully Automatic Semiconductor Molding Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Fully Automatic Semiconductor Molding Equipment Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Fully Automatic Semiconductor Molding Equipment Production by Type (2018-2029)
5.1.1 Global Fully Automatic Semiconductor Molding Equipment Production by Type (2018-2023)
5.1.2 Global Fully Automatic Semiconductor Molding Equipment Production by Type (2024-2029)
5.1.3 Global Fully Automatic Semiconductor Molding Equipment Production Market Share by Type (2018-2029)
5.2 Global Fully Automatic Semiconductor Molding Equipment Production Value by Type (2018-2029)
5.2.1 Global Fully Automatic Semiconductor Molding Equipment Production Value by Type (2018-2023)
5.2.2 Global Fully Automatic Semiconductor Molding Equipment Production Value by Type (2024-2029)
5.2.3 Global Fully Automatic Semiconductor Molding Equipment Production Value Market Share by Type (2018-2029)
5.3 Global Fully Automatic Semiconductor Molding Equipment Price by Type (2018-2029)
6 Segment by Application
6.1 Global Fully Automatic Semiconductor Molding Equipment Production by Application (2018-2029)
6.1.1 Global Fully Automatic Semiconductor Molding Equipment Production by Application (2018-2023)
6.1.2 Global Fully Automatic Semiconductor Molding Equipment Production by Application (2024-2029)
6.1.3 Global Fully Automatic Semiconductor Molding Equipment Production Market Share by Application (2018-2029)
6.2 Global Fully Automatic Semiconductor Molding Equipment Production Value by Application (2018-2029)
6.2.1 Global Fully Automatic Semiconductor Molding Equipment Production Value by Application (2018-2023)
6.2.2 Global Fully Automatic Semiconductor Molding Equipment Production Value by Application (2024-2029)
6.2.3 Global Fully Automatic Semiconductor Molding Equipment Production Value Market Share by Application (2018-2029)
6.3 Global Fully Automatic Semiconductor Molding Equipment Price by Application (2018-2029)
7 Key Companies Profiled
7.1 TOWA
7.1.1 TOWA Fully Automatic Semiconductor Molding Equipment Corporation Information
7.1.2 TOWA Fully Automatic Semiconductor Molding Equipment Product Portfolio
7.1.3 TOWA Fully Automatic Semiconductor Molding Equipment Production, Value, Price and Gross Margin (2018-2023)
7.1.4 TOWA Main Business and Markets Served
7.1.5 TOWA Recent Developments/Updates
7.2 ASMPT
7.2.1 ASMPT Fully Automatic Semiconductor Molding Equipment Corporation Information
7.2.2 ASMPT Fully Automatic Semiconductor Molding Equipment Product Portfolio
7.2.3 ASMPT Fully Automatic Semiconductor Molding Equipment Production, Value, Price and Gross Margin (2018-2023)
7.2.4 ASMPT Main Business and Markets Served
7.2.5 ASMPT Recent Developments/Updates
7.3 Besi
7.3.1 Besi Fully Automatic Semiconductor Molding Equipment Corporation Information
7.3.2 Besi Fully Automatic Semiconductor Molding Equipment Product Portfolio
7.3.3 Besi Fully Automatic Semiconductor Molding Equipment Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Besi Main Business and Markets Served
7.3.5 Besi Recent Developments/Updates
7.4 I-PEX
7.4.1 I-PEX Fully Automatic Semiconductor Molding Equipment Corporation Information
7.4.2 I-PEX Fully Automatic Semiconductor Molding Equipment Product Portfolio
7.4.3 I-PEX Fully Automatic Semiconductor Molding Equipment Production, Value, Price and Gross Margin (2018-2023)
7.4.4 I-PEX Main Business and Markets Served
7.4.5 I-PEX Recent Developments/Updates
7.5 Yamada
7.5.1 Yamada Fully Automatic Semiconductor Molding Equipment Corporation Information
7.5.2 Yamada Fully Automatic Semiconductor Molding Equipment Product Portfolio
7.5.3 Yamada Fully Automatic Semiconductor Molding Equipment Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Yamada Main Business and Markets Served
7.5.5 Yamada Recent Developments/Updates
7.6 TAKARA TOOL & DIE
7.6.1 TAKARA TOOL & DIE Fully Automatic Semiconductor Molding Equipment Corporation Information
7.6.2 TAKARA TOOL & DIE Fully Automatic Semiconductor Molding Equipment Product Portfolio
7.6.3 TAKARA TOOL & DIE Fully Automatic Semiconductor Molding Equipment Production, Value, Price and Gross Margin (2018-2023)
7.6.4 TAKARA TOOL & DIE Main Business and Markets Served
7.6.5 TAKARA TOOL & DIE Recent Developments/Updates
7.7 Asahi Engineering
7.7.1 Asahi Engineering Fully Automatic Semiconductor Molding Equipment Corporation Information
7.7.2 Asahi Engineering Fully Automatic Semiconductor Molding Equipment Product Portfolio
7.7.3 Asahi Engineering Fully Automatic Semiconductor Molding Equipment Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Asahi Engineering Main Business and Markets Served
7.7.5 Asahi Engineering Recent Developments/Updates
7.8 Tongling Fushi Sanjia
7.8.1 Tongling Fushi Sanjia Fully Automatic Semiconductor Molding Equipment Corporation Information
7.8.2 Tongling Fushi Sanjia Fully Automatic Semiconductor Molding Equipment Product Portfolio
7.8.3 Tongling Fushi Sanjia Fully Automatic Semiconductor Molding Equipment Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Tongling Fushi Sanjia Main Business and Markets Served
7.7.5 Tongling Fushi Sanjia Recent Developments/Updates
7.9 Nextool Technology
7.9.1 Nextool Technology Fully Automatic Semiconductor Molding Equipment Corporation Information
7.9.2 Nextool Technology Fully Automatic Semiconductor Molding Equipment Product Portfolio
7.9.3 Nextool Technology Fully Automatic Semiconductor Molding Equipment Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Nextool Technology Main Business and Markets Served
7.9.5 Nextool Technology Recent Developments/Updates
7.10 DAHUA Technology
7.10.1 DAHUA Technology Fully Automatic Semiconductor Molding Equipment Corporation Information
7.10.2 DAHUA Technology Fully Automatic Semiconductor Molding Equipment Product Portfolio
7.10.3 DAHUA Technology Fully Automatic Semiconductor Molding Equipment Production, Value, Price and Gross Margin (2018-2023)
7.10.4 DAHUA Technology Main Business and Markets Served
7.10.5 DAHUA Technology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Fully Automatic Semiconductor Molding Equipment Industry Chain Analysis
8.2 Fully Automatic Semiconductor Molding Equipment Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Fully Automatic Semiconductor Molding Equipment Production Mode & Process
8.4 Fully Automatic Semiconductor Molding Equipment Sales and Marketing
8.4.1 Fully Automatic Semiconductor Molding Equipment Sales Channels
8.4.2 Fully Automatic Semiconductor Molding Equipment Distributors
8.5 Fully Automatic Semiconductor Molding Equipment Customers
9 Fully Automatic Semiconductor Molding Equipment Market Dynamics
9.1 Fully Automatic Semiconductor Molding Equipment Industry Trends
9.2 Fully Automatic Semiconductor Molding Equipment Market Drivers
9.3 Fully Automatic Semiconductor Molding Equipment Market Challenges
9.4 Fully Automatic Semiconductor Molding Equipment Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer