▶ 調査レポート

有線インターフェイスのグローバル市場(~2027):DisplayPort有線インターフェース、HDMI有線インターフェース、Thunderbolt有線インターフェース、USB有線インターフェース

• 英文タイトル:Wired Interface Market Research Report by Component, Device, Region - Global Forecast to 2027 - Cumulative Impact of COVID-19

Wired Interface Market Research Report by Component, Device, Region - Global Forecast to 2027 - Cumulative Impact of COVID-19「有線インターフェイスのグローバル市場(~2027):DisplayPort有線インターフェース、HDMI有線インターフェース、Thunderbolt有線インターフェース、USB有線インターフェース」(市場規模、市場予測)調査レポートです。• レポートコード:MRC2305D022
• 出版社/出版日:360iResearch / 2022年10月
• レポート形態:英語、PDF、226ページ
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レポート概要
360iResearch社は、世界の有線インターフェイス市場規模が2021年に210.4億ドル、2022年には235.9億ドルに達し、更に年平均12.30%成長して2027年には422.1億ドルまで拡大すると予測しています。当調査資料は、有線インターフェイスの世界市場についての多面的な調査を元に、序論、調査方法、エグゼクティブサマリー、市場概要、市場インサイト、コンポーネント別分析(DisplayPort有線インターフェース、HDMI有線インターフェース、Thunderbolt有線インターフェース、USB有線インターフェース)、デバイス別分析(自動車、カメラ、ディスプレイモニター、ドローン、外付けハードディスク)、地域別分析(南北アメリカ、アメリカ、カナダ、ブラジル、アジア太平洋、日本、中国、インド、韓国、台湾、ヨーロッパ/中東/アフリカ、イギリス、ドイツ、フランス、ロシア、その他)、競争状況、企業情報などの構成でまとめております。また、当書には、Amphenol Corporation、Analog Devices Inc.、Cui, Inc.、Cypress Semiconductor Corp.、Diodes Inc.、Hirose Electric Co., Ltd.、Japan Aviation Electronics Industry, Ltd.、Maxim Integrated Products, Inc.、Microchip Technology Inc、Molex Inc.、Murata Manufacturing Co. Ltd.などの企業情報が含まれています。

・序論
・調査方法
・エグゼクティブサマリー
・市場概要
・市場インサイト
・世界の有線インターフェイス市場規模:コンポーネント別
- DisplayPort有線インターフェースの市場規模
- HDMI有線インターフェースの市場規模
- Thunderbolt有線インターフェースの市場規模
- USB有線インターフェースの市場規模
・世界の有線インターフェイス市場規模:デバイス別
- 自動車の市場規模
- カメラの市場規模
- ディスプレイモニターの市場規模
- ドローンの市場規模
- 外付けハードディスクの市場規模
・世界の有線インターフェイス市場規模:地域別
- 南北アメリカの有線インターフェイス市場規模
アメリカの有線インターフェイス市場規模
カナダの有線インターフェイス市場規模
ブラジルの有線インターフェイス市場規模
...
- アジア太平洋の有線インターフェイス市場規模
日本の有線インターフェイス市場規模
中国の有線インターフェイス市場規模
インドの有線インターフェイス市場規模
韓国の有線インターフェイス市場規模
台湾の有線インターフェイス市場規模
...
- ヨーロッパ/中東/アフリカの有線インターフェイス市場規模
イギリスの有線インターフェイス市場規模
ドイツの有線インターフェイス市場規模
フランスの有線インターフェイス市場規模
ロシアの有線インターフェイス市場規模
...
- その他地域の有線インターフェイス市場規模
・競争状況
・企業情報

The Global Wired Interface Market size was estimated at USD 21.04 billion in 2021 and expected to reach USD 23.59 billion in 2022, and is projected to grow at a CAGR 12.30% to reach USD 42.21 billion by 2027.

Market Statistics:
The report provides market sizing and forecast across 7 major currencies – USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2020 are considered as historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered as the forecast period.

Market Segmentation & Coverage:
This research report categorizes the Wired Interface to forecast the revenues and analyze the trends in each of the following sub-markets:

Based on Component, the market was studied across Displayport Wired Interface, Hdmi Wired Interface, Thunderbolt Wired Interface, and Usb Wired Interface. The Usb Wired Interface is further studied across Other Usb Type Wired Interface and Usb Type C Wired Interface.

Based on Device, the market was studied across Automotive, Camera, Display Monitor, Drones, External Hard Disk, Gaming Console, Home Theatre And Multimedia Device, Pc And Laptop, Power Bank, Projector, Set-top Box, Smartphone, Tablet, Television, Usb Flash Drive, Virtual Reality, and Wearable.

Based on Region, the market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

Cumulative Impact of COVID-19:
COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.

Cumulative Impact of 2022 Russia Ukraine Conflict:
We continuously monitor and update reports on political and economic uncertainty due to the Russian invasion of Ukraine. Negative impacts are significantly foreseen globally, especially across Eastern Europe, European Union, Eastern & Central Asia, and the United States. This contention has severely affected lives and livelihoods and represents far-reaching disruptions in trade dynamics. The potential effects of ongoing war and uncertainty in Eastern Europe are expected to have an adverse impact on the world economy, with especially long-term harsh effects on Russia.This report uncovers the impact of demand & supply, pricing variants, strategic uptake of vendors, and recommendations for Wired Interface market considering the current update on the conflict and its global response.

Competitive Strategic Window:
The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.

FPNV Positioning Matrix:
The FPNV Positioning Matrix evaluates and categorizes the vendors in the Wired Interface Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.

Market Share Analysis:
The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.

Competitive Scenario:
The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.

Company Usability Profiles:
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global Wired Interface Market, including Amphenol Corporation, Analog Devices Inc., Cui, Inc., Cypress Semiconductor Corp., Diodes Inc., Hirose Electric Co., Ltd., Japan Aviation Electronics Industry, Ltd., Maxim Integrated Products, Inc., Microchip Technology Inc, Molex Inc., Murata Manufacturing Co. Ltd., Nxp Semiconductors N.V., On Semiconductor Corporation, Rohm Co., Ltd., Silicon Laboratories Inc., Stmicroelectronics N.V., Te Connectivity Ltd., Texas Instruments Inc, Vishay Intertechnology, Inc., and Yamaichi Electronics Co. Ltd.

The report provides insights on the following pointers:
1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments

The report answers questions such as:
1. What is the market size and forecast of the Global Wired Interface Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global Wired Interface Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Wired Interface Market?
4. What is the competitive strategic window for opportunities in the Global Wired Interface Market?
5. What are the technology trends and regulatory frameworks in the Global Wired Interface Market?
6. What is the market share of the leading vendors in the Global Wired Interface Market?
7. What modes and strategic moves are considered suitable for entering the Global Wired Interface Market?

レポート目次

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders

2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Growing penetration of smartphones worldwide
5.1.1.2. Rising demand for automotive infotainment
5.1.1.3. Adoption of low data streaming capacity of Bluetooth and Wi-Fi technology
5.1.2. Restraints
5.1.2.1. Reduction in shipment of PCS and tablets
5.1.3. Opportunities
5.1.3.1. Increasing demand for drones
5.1.3.2. Application of wired interface in various applications
5.1.4. Challenges
5.1.4.1. Concerns associated to product certification
5.2. Cumulative Impact of COVID-19

6. Wired Interface Market, by Component
6.1. Introduction
6.2. Displayport Wired Interface
6.3. Hdmi Wired Interface
6.4. Thunderbolt Wired Interface
6.5. Usb Wired Interface
6.6.1. Other Usb Type Wired Interface
6.6.2. Usb Type C Wired Interface

7. Wired Interface Market, by Device
7.1. Introduction
7.2. Automotive
7.3. Camera
7.4. Display Monitor
7.5. Drones
7.6. External Hard Disk
7.7. Gaming Console
7.8. Home Theatre And Multimedia Device
7.9. Pc And Laptop
7.10. Power Bank
7.11. Projector
7.12. Set-top Box
7.13. Smartphone
7.14. Tablet
7.15. Television
7.16. Usb Flash Drive
7.17. Virtual Reality
7.18. Wearable

8. Americas Wired Interface Market
8.1. Introduction
8.2. Argentina
8.3. Brazil
8.4. Canada
8.5. Mexico
8.6. United States

9. Asia-Pacific Wired Interface Market
9.1. Introduction
9.2. Australia
9.3. China
9.4. India
9.5. Indonesia
9.6. Japan
9.7. Malaysia
9.8. Philippines
9.9. Singapore
9.10. South Korea
9.11. Taiwan
9.12. Thailand
9.13. Vietnam

10. Europe, Middle East & Africa Wired Interface Market
10.1. Introduction
10.2. Denmark
10.3. Egypt
10.4. Finland
10.5. France
10.6. Germany
10.7. Israel
10.8. Italy
10.9. Netherlands
10.10. Nigeria
10.11. Norway
10.12. Poland
10.13. Qatar
10.14. Russia
10.15. Saudi Arabia
10.16. South Africa
10.17. Spain
10.18. Sweden
10.19. Switzerland
10.20. Turkey
10.21. United Arab Emirates
10.22. United Kingdom

11. Competitive Landscape
11.1. FPNV Positioning Matrix
11.1.1. Quadrants
11.1.2. Business Strategy
11.1.3. Product Satisfaction
11.2. Market Ranking Analysis, By Key Player
11.3. Market Share Analysis, By Key Player
11.4. Competitive Scenario
11.4.1. Merger & Acquisition
11.4.2. Agreement, Collaboration, & Partnership
11.4.3. New Product Launch & Enhancement
11.4.4. Investment & Funding
11.4.5. Award, Recognition, & Expansion

12. Company Usability Profiles
12.1. Amphenol Corporation
12.1.1. Business Overview
12.1.2. Key Executives
12.1.3. Product & Services
12.2. Analog Devices Inc.
12.2.1. Business Overview
12.2.2. Key Executives
12.2.3. Product & Services
12.3. Cui, Inc.
12.3.1. Business Overview
12.3.2. Key Executives
12.3.3. Product & Services
12.4. Cypress Semiconductor Corp.
12.4.1. Business Overview
12.4.2. Key Executives
12.4.3. Product & Services
12.5. Diodes Inc.
12.5.1. Business Overview
12.5.2. Key Executives
12.5.3. Product & Services
12.6. Hirose Electric Co., Ltd.
12.6.1. Business Overview
12.6.2. Key Executives
12.6.3. Product & Services
12.7. Japan Aviation Electronics Industry, Ltd.
12.7.1. Business Overview
12.7.2. Key Executives
12.7.3. Product & Services
12.8. Maxim Integrated Products, Inc.
12.8.1. Business Overview
12.8.2. Key Executives
12.8.3. Product & Services
12.9. Microchip Technology Inc
12.9.1. Business Overview
12.9.2. Key Executives
12.9.3. Product & Services
12.10. Molex Inc.
12.10.1. Business Overview
12.10.2. Key Executives
12.10.3. Product & Services
12.11. Murata Manufacturing Co. Ltd.
12.11.1. Business Overview
12.11.2. Key Executives
12.11.3. Product & Services
12.12. Nxp Semiconductors N.V.
12.12.1. Business Overview
12.12.2. Key Executives
12.12.3. Product & Services
12.13. On Semiconductor Corporation
12.13.1. Business Overview
12.13.2. Key Executives
12.13.3. Product & Services
12.14. Rohm Co., Ltd.
12.14.1. Business Overview
12.14.2. Key Executives
12.14.3. Product & Services
12.15. Silicon Laboratories Inc.
12.15.1. Business Overview
12.15.2. Key Executives
12.15.3. Product & Services
12.16. Stmicroelectronics N.V.
12.16.1. Business Overview
12.16.2. Key Executives
12.16.3. Product & Services
12.17. Te Connectivity Ltd.
12.17.1. Business Overview
12.17.2. Key Executives
12.17.3. Product & Services
12.18. Texas Instruments Inc
12.18.1. Business Overview
12.18.2. Key Executives
12.18.3. Product & Services
12.19. Vishay Intertechnology, Inc.
12.19.1. Business Overview
12.19.2. Key Executives
12.19.3. Product & Services
12.20. Yamaichi Electronics Co. Ltd
12.20.1. Business Overview
12.20.2. Key Executives
12.20.3. Product & Services

13. Appendix
13.1. Discussion Guide
13.2. License & Pricing