 | • レポートコード：MRC2305B018 • 出版社/出版日：360iResearch / 2022年10月 • レポート形態：英語、PDF、220ページ • 納品方法：Eメール（受注後2-3日） • 産業分類：電子 |
| Single User（1名利用、印刷可） | ￥742,350 (USD4,949) | ▷ お問い合わせ |
| Enterprise License（企業利用、印刷可） | ￥1,492,350 (USD9,949) | ▷ お問い合わせ |
• お支払方法：銀行振込（納品後、ご請求書送付）
レポート概要
| 360iResearch社は、2021年に1,892.11百万ドルであった世界の成形回路部品（MID）市場規模が、2022年には2,150.58百万ドルに達し、2027年までに年平均13.91％成長して4,134.59百万ドルになると予測しています。当調査資料では、成形回路部品（MID）の世界市場について調査・分析を行い、序論、調査方法、エグゼクティブサマリー、市場概要、市場インサイト、製品タイプ別分析（アンテナ＆接続モジュール、コネクタ＆スイッチ、照明システム、センサー）、プロセス別分析（フィルム技術、レーザーダイレクトストラクチャリング（LDS）、ツーショット成形）、産業別分析（自動車、家電、工業、医療、軍事＆防衛）、地域別分析（南北アメリカ、アメリカ、カナダ、ブラジル、アジア太平洋、日本、中国、インド、韓国、台湾、ヨーロッパ/中東/アフリカ、イギリス、ドイツ、フランス、ロシア、その他）、競争状況、企業情報などの項目をまとめました。なお、当書に掲載されている企業情報には、2E Mechatronic GmbH、Amphenol Corporation、Arlington Plating Company、AVX Corporation、DURATECH INDUSTRIES、GALTRONICS Corporation Limited、Harting Group、Johnan Manufacturing Inc.、LPKF Laser & Electronicsなどが含まれています。 ・序論 ・調査方法 ・エグゼクティブサマリー ・市場概要 ・市場インサイト ・世界の成形回路部品（MID）市場規模：製品タイプ別 - アンテナ＆接続モジュールの市場規模 - コネクタ＆スイッチの市場規模 - 照明システムの市場規模 - センサーの市場規模 ・世界の成形回路部品（MID）市場規模：プロセス別 - フィルム技術の市場規模 - レーザーダイレクトストラクチャリング（LDS）の市場規模 - ツーショット成形の市場規模 ・世界の成形回路部品（MID）市場規模：産業別 - 自動車における市場規模 - 家電における市場規模 - 工業における市場規模 - 医療における市場規模 - 軍事＆防衛における市場規模 ・世界の成形回路部品（MID）市場規模：地域別 - 南北アメリカの成形回路部品（MID）市場規模 アメリカの成形回路部品（MID）市場規模 カナダの成形回路部品（MID）市場規模 ブラジルの成形回路部品（MID）市場規模 ... - アジア太平洋の成形回路部品（MID）市場規模 日本の成形回路部品（MID）市場規模 中国の成形回路部品（MID）市場規模 インドの成形回路部品（MID）市場規模 韓国の成形回路部品（MID）市場規模 台湾の成形回路部品（MID）市場規模 ... - ヨーロッパ/中東/アフリカの成形回路部品（MID）市場規模 イギリスの成形回路部品（MID）市場規模 ドイツの成形回路部品（MID）市場規模 フランスの成形回路部品（MID）市場規模 ロシアの成形回路部品（MID）市場規模 ... - その他地域の成形回路部品（MID）市場規模 ・競争状況 ・企業情報 |
The Global Molded Interconnect Device Market size was estimated at USD 1,892.11 million in 2021 and expected to reach USD 2,150.58 million in 2022, and is projected to grow at a CAGR 13.91% to reach USD 4,134.59 million by 2027.
Market Statistics:
The report provides market sizing and forecast across 7 major currencies – USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2020 are considered as historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered as the forecast period.
Market Segmentation & Coverage:
This research report categorizes the Molded Interconnect Device to forecast the revenues and analyze the trends in each of the following sub-markets:
Based on Product Type, the market was studied across Antennae & Connectivity Modules, Connectors & Switches, Lighting Systems, and Sensors.
Based on Process, the market was studied across Film Techniques, Laser Direct Structuring (LDS), and Two-Shot Molding.
Based on Vertical, the market was studied across Automotive, Consumer Electronics, Industrial, Medical, Military & Aerospace, and Telecommunications.
Based on Region, the market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.
Cumulative Impact of COVID-19:
COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.
Cumulative Impact of 2022 Russia Ukraine Conflict:
We continuously monitor and update reports on political and economic uncertainty due to the Russian invasion of Ukraine. Negative impacts are significantly foreseen globally, especially across Eastern Europe, European Union, Eastern & Central Asia, and the United States. This contention has severely affected lives and livelihoods and represents far-reaching disruptions in trade dynamics. The potential effects of ongoing war and uncertainty in Eastern Europe are expected to have an adverse impact on the world economy, with especially long-term harsh effects on Russia.This report uncovers the impact of demand & supply, pricing variants, strategic uptake of vendors, and recommendations for Molded Interconnect Device market considering the current update on the conflict and its global response.
Competitive Strategic Window:
The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.
FPNV Positioning Matrix:
The FPNV Positioning Matrix evaluates and categorizes the vendors in the Molded Interconnect Device Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.
Market Share Analysis:
The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.
Competitive Scenario:
The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.
Company Usability Profiles:
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global Molded Interconnect Device Market, including 2E Mechatronic GmbH, Amphenol Corporation, Arlington Plating Company, AVX Corporation, DURATECH INDUSTRIES, GALTRONICS Corporation Limited, Harting Group, Johnan Manufacturing Inc., LPKF Laser & Electronics, MID Solutions, Molex LLC, RTP Company, SelectConnect Technologies, SUZHOU CICOR TECHNOLOGY CO. LTD, SUZHOU ZEETEK ELECTRONICS, Taoglas, TE Connectivity, Teprosa GmbH, Tongda Group, YAZAKI CORPORATION, and Yomura Technologies Inc.
The report provides insights on the following pointers:
1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments
The report answers questions such as:
1. What is the market size and forecast of the Global Molded Interconnect Device Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global Molded Interconnect Device Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Molded Interconnect Device Market?
4. What is the competitive strategic window for opportunities in the Global Molded Interconnect Device Market?
5. What are the technology trends and regulatory frameworks in the Global Molded Interconnect Device Market?
6. What is the market share of the leading vendors in the Global Molded Interconnect Device Market?
7. What modes and strategic moves are considered suitable for entering the Global Molded Interconnect Device Market?
1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Rising need in healthcare and consumer electronics industry
5.1.1.2. Wide applications in automotive industry
5.1.1.3. Favorable regulatory scenario for the electronic waste reduction
5.1.2. Restraints
5.1.2.1. Concern pertaining to raw materials cost
5.1.3. Opportunities
5.1.3.1. Potential growth of 5G antennas
5.1.3.2. Enlargement of IIoT ecosystem
5.1.4. Challenges
5.1.4.1. Incomptability issues of molded interconnected devices
5.2. Cumulative Impact of COVID-19
6. Molded Interconnect Device Market, by Product Type
6.1. Introduction
6.2. Antennae & Connectivity Modules
6.3. Connectors & Switches
6.4. Lighting Systems
6.5. Sensors
7. Molded Interconnect Device Market, by Process
7.1. Introduction
7.2. Film Techniques
7.3. Laser Direct Structuring (LDS)
7.4. Two-Shot Molding
8. Molded Interconnect Device Market, by Vertical
8.1. Introduction
8.2. Automotive
8.3. Consumer Electronics
8.4. Industrial
8.5. Medical
8.6. Military & Aerospace
8.7. Telecommunications
9. Americas Molded Interconnect Device Market
9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States
10. Asia-Pacific Molded Interconnect Device Market
10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam
11. Europe, Middle East & Africa Molded Interconnect Device Market
11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom
12. Competitive Landscape
12.1. FPNV Positioning Matrix
12.1.1. Quadrants
12.1.2. Business Strategy
12.1.3. Product Satisfaction
12.2. Market Ranking Analysis, By Key Player
12.3. Market Share Analysis, By Key Player
12.4. Competitive Scenario
12.4.1. Merger & Acquisition
12.4.2. Agreement, Collaboration, & Partnership
12.4.3. New Product Launch & Enhancement
12.4.4. Investment & Funding
12.4.5. Award, Recognition, & Expansion
13. Company Usability Profiles
13.1. 2E Mechatronic GmbH
13.1.1. Business Overview
13.1.2. Key Executives
13.1.3. Product & Services
13.2. Amphenol Corporation
13.2.1. Business Overview
13.2.2. Key Executives
13.2.3. Product & Services
13.3. Arlington Plating Company
13.3.1. Business Overview
13.3.2. Key Executives
13.3.3. Product & Services
13.4. AVX Corporation
13.4.1. Business Overview
13.4.2. Key Executives
13.4.3. Product & Services
13.5. DURATECH INDUSTRIES
13.5.1. Business Overview
13.5.2. Key Executives
13.5.3. Product & Services
13.6. GALTRONICS Corporation Limited
13.6.1. Business Overview
13.6.2. Key Executives
13.6.3. Product & Services
13.7. Harting Group
13.7.1. Business Overview
13.7.2. Key Executives
13.7.3. Product & Services
13.8. Johnan Manufacturing Inc.
13.8.1. Business Overview
13.8.2. Key Executives
13.8.3. Product & Services
13.9. LPKF Laser & Electronics
13.9.1. Business Overview
13.9.2. Key Executives
13.9.3. Product & Services
13.10. MID Solutions
13.10.1. Business Overview
13.10.2. Key Executives
13.10.3. Product & Services
13.11. Molex LLC
13.11.1. Business Overview
13.11.2. Key Executives
13.11.3. Product & Services
13.12. RTP Company
13.12.1. Business Overview
13.12.2. Key Executives
13.12.3. Product & Services
13.13. SelectConnect Technologies
13.13.1. Business Overview
13.13.2. Key Executives
13.13.3. Product & Services
13.14. SUZHOU CICOR TECHNOLOGY CO. LTD
13.14.1. Business Overview
13.14.2. Key Executives
13.14.3. Product & Services
13.15. SUZHOU ZEETEK ELECTRONICS
13.15.1. Business Overview
13.15.2. Key Executives
13.15.3. Product & Services
13.16. Taoglas
13.16.1. Business Overview
13.16.2. Key Executives
13.16.3. Product & Services
13.17. TE Connectivity
13.17.1. Business Overview
13.17.2. Key Executives
13.17.3. Product & Services
13.18. Teprosa GmbH
13.18.1. Business Overview
13.18.2. Key Executives
13.18.3. Product & Services
13.19. Tongda Group
13.19.1. Business Overview
13.19.2. Key Executives
13.19.3. Product & Services
13.20. YAZAKI CORPORATION
13.20.1. Business Overview
13.20.2. Key Executives
13.20.3. Product & Services
13.21. Yomura Technologies Inc
13.21.1. Business Overview
13.21.2. Key Executives
13.21.3. Product & Services
14. Appendix
14.1. Discussion Guide
14.2. License & Pricing