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レポート概要
| 360iResearch社の当調査レポートでは、世界のスマートカード用IC（集積回路）市場規模が2021年に4,022.94百万ドル、2022年に4,202.03百万ドルとなり、その後2027年までにCAGR 4.62％で成長して5,277.79百万ドルに達すると予測しています。当書は、スマートカード用IC（集積回路）の世界市場を対象とした調査・分析結果をまとめたものであり、序論、調査方法、エグゼクティブサマリー、市場概要、市場インサイト、カード種類別分析（メモリー、マイクロコントローラ）、インターフェース別分析（接触式、非接触式）、産業別分析（電子政府、決済＆銀行、通信）、地域別分析（南北アメリカ、アメリカ、カナダ、ブラジル、アジア太平洋、日本、中国、インド、韓国、台湾、ヨーロッパ/中東/アフリカ、イギリス、ドイツ、フランス、ロシア、その他）、競争状況、企業情報などの内容を掲載しています。また、当書には、Atmel Corporation、Broadcom Inc、CEC Huada Electronic Design Co., Ltd.、CPI Card Group、EM Microelectronic、IDEMIA、Imatric LLC、Infineon Technologies AG、Microchip Technology Inc.、NEDCARD、NXP Semiconductors N.V.などの企業情報が含まれています。 ・序論 ・調査方法 ・エグゼクティブサマリー ・市場概要 ・市場インサイト ・世界のスマートカード用IC（集積回路）市場規模：カード種類別 - メモリーの市場規模 - マイクロコントローラの市場規模 ・世界のスマートカード用IC（集積回路）市場規模：インターフェース別 - 接触式スマートカード用IC（集積回路）の市場規模 - 非接触式スマートカード用IC（集積回路）の市場規模 ・世界のスマートカード用IC（集積回路）市場規模：産業別 - 電子政府における市場規模 - 決済＆銀行における市場規模 - 通信における市場規模 ・世界のスマートカード用IC（集積回路）市場規模：地域別 - 南北アメリカのスマートカード用IC（集積回路）市場規模 アメリカのスマートカード用IC（集積回路）市場規模 カナダのスマートカード用IC（集積回路）市場規模 ブラジルのスマートカード用IC（集積回路）市場規模 ... - アジア太平洋のスマートカード用IC（集積回路）市場規模 日本のスマートカード用IC（集積回路）市場規模 中国のスマートカード用IC（集積回路）市場規模 インドのスマートカード用IC（集積回路）市場規模 韓国のスマートカード用IC（集積回路）市場規模 台湾のスマートカード用IC（集積回路）市場規模 ... - ヨーロッパ/中東/アフリカのスマートカード用IC（集積回路）市場規模 イギリスのスマートカード用IC（集積回路）市場規模 ドイツのスマートカード用IC（集積回路）市場規模 フランスのスマートカード用IC（集積回路）市場規模 ロシアのスマートカード用IC（集積回路）市場規模 ... - その他地域のスマートカード用IC（集積回路）市場規模 ・競争状況 ・企業情報 |
The Global Smart Card Integrated Circuit Market size was estimated at USD 4,022.94 million in 2021 and expected to reach USD 4,202.03 million in 2022, and is projected to grow at a CAGR 4.62% to reach USD 5,277.79 million by 2027.
Market Statistics:
The report provides market sizing and forecast across 7 major currencies – USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2020 are considered as historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered as the forecast period.
Market Segmentation & Coverage:
This research report categorizes the Smart Card Integrated Circuit to forecast the revenues and analyze the trends in each of the following sub-markets:
Based on Card Type, the market was studied across Memory and Microcontroller.
Based on Interface, the market was studied across Contact and Contactless.
Based on End-use Industry, the market was studied across E-Government, Payment and Banking, and Telecommunication.
Based on Region, the market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.
Cumulative Impact of COVID-19:
COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.
Cumulative Impact of 2022 Russia Ukraine Conflict:
We continuously monitor and update reports on political and economic uncertainty due to the Russian invasion of Ukraine. Negative impacts are significantly foreseen globally, especially across Eastern Europe, European Union, Eastern & Central Asia, and the United States. This contention has severely affected lives and livelihoods and represents far-reaching disruptions in trade dynamics. The potential effects of ongoing war and uncertainty in Eastern Europe are expected to have an adverse impact on the world economy, with especially long-term harsh effects on Russia.This report uncovers the impact of demand & supply, pricing variants, strategic uptake of vendors, and recommendations for Smart Card Integrated Circuit market considering the current update on the conflict and its global response.
Competitive Strategic Window:
The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.
FPNV Positioning Matrix:
The FPNV Positioning Matrix evaluates and categorizes the vendors in the Smart Card Integrated Circuit Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.
Market Share Analysis:
The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.
Competitive Scenario:
The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.
Company Usability Profiles:
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global Smart Card Integrated Circuit Market, including Atmel Corporation, Broadcom Inc, CEC Huada Electronic Design Co., Ltd., CPI Card Group, EM Microelectronic, IDEMIA, Imatric LLC, Infineon Technologies AG, Microchip Technology Inc., NEDCARD, NXP Semiconductors N.V., ON Semiconductor, On Semiconductor Corporation, Renesas Electronics Corporation, SAFRAN, Samsung Electronics Co. Ltd., Shanghai Huahong Integrated Circuit Co., Ltd., STMicroelectronics, Toshiba Corporation, and Watchdata System Co. Ltd..
The report provides insights on the following pointers:
1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments
The report answers questions such as:
1. What is the market size and forecast of the Global Smart Card Integrated Circuit Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global Smart Card Integrated Circuit Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Smart Card Integrated Circuit Market?
4. What is the competitive strategic window for opportunities in the Global Smart Card Integrated Circuit Market?
5. What are the technology trends and regulatory frameworks in the Global Smart Card Integrated Circuit Market?
6. What is the market share of the leading vendors in the Global Smart Card Integrated Circuit Market?
7. What modes and strategic moves are considered suitable for entering the Global Smart Card Integrated Circuit Market?
1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Surge in applications across industries such as transportation, telecommunication, and banking
5.1.1.2. Growing use of SIM cards in smartphones globally
5.1.1.3. Rising deployment of electronic identification cards for government projects
5.1.2. Restraints
5.1.2.1. Reduced adoption across few regions
5.1.3. Opportunities
5.1.3.1. Emerging integration of smart cards with biometrics to enhance security
5.1.3.2. Increasing demand for contactless transactions
5.1.4. Challenges
5.1.4.1. Issues pertinent to security and privacy
5.2. Cumulative Impact of COVID-19
6. Smart Card Integrated Circuit Market, by Card Type
6.1. Introduction
6.2. Memory
6.3. Microcontroller
7. Smart Card Integrated Circuit Market, by Interface
7.1. Introduction
7.2. Contact
7.3. Contactless
8. Smart Card Integrated Circuit Market, by End-use Industry
8.1. Introduction
8.2. E-Government
8.3. Payment and Banking
8.4. Telecommunication
9. Americas Smart Card Integrated Circuit Market
9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States
10. Asia-Pacific Smart Card Integrated Circuit Market
10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam
11. Europe, Middle East & Africa Smart Card Integrated Circuit Market
11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom
12. Competitive Landscape
12.1. FPNV Positioning Matrix
12.1.1. Quadrants
12.1.2. Business Strategy
12.1.3. Product Satisfaction
12.2. Market Ranking Analysis, By Key Player
12.3. Market Share Analysis, By Key Player
12.4. Competitive Scenario
12.4.1. Merger & Acquisition
12.4.2. Agreement, Collaboration, & Partnership
12.4.3. New Product Launch & Enhancement
12.4.4. Investment & Funding
12.4.5. Award, Recognition, & Expansion
13. Company Usability Profiles
13.1. Atmel Corporation
13.1.1. Business Overview
13.1.2. Key Executives
13.1.3. Product & Services
13.2. Broadcom Inc
13.2.1. Business Overview
13.2.2. Key Executives
13.2.3. Product & Services
13.3. CEC Huada Electronic Design Co., Ltd.
13.3.1. Business Overview
13.3.2. Key Executives
13.3.3. Product & Services
13.4. CPI Card Group
13.4.1. Business Overview
13.4.2. Key Executives
13.4.3. Product & Services
13.5. EM Microelectronic
13.5.1. Business Overview
13.5.2. Key Executives
13.5.3. Product & Services
13.6. IDEMIA
13.6.1. Business Overview
13.6.2. Key Executives
13.6.3. Product & Services
13.7. Imatric LLC
13.7.1. Business Overview
13.7.2. Key Executives
13.7.3. Product & Services
13.8. Infineon Technologies AG
13.8.1. Business Overview
13.8.2. Key Executives
13.8.3. Product & Services
13.9. Microchip Technology Inc.
13.9.1. Business Overview
13.9.2. Key Executives
13.9.3. Product & Services
13.10. NEDCARD
13.10.1. Business Overview
13.10.2. Key Executives
13.10.3. Product & Services
13.11. NXP Semiconductors N.V.
13.11.1. Business Overview
13.11.2. Key Executives
13.11.3. Product & Services
13.12. ON Semiconductor
13.12.1. Business Overview
13.12.2. Key Executives
13.12.3. Product & Services
13.13. On Semiconductor Corporation
13.13.1. Business Overview
13.13.2. Key Executives
13.13.3. Product & Services
13.14. Renesas Electronics Corporation
13.14.1. Business Overview
13.14.2. Key Executives
13.14.3. Product & Services
13.15. SAFRAN
13.15.1. Business Overview
13.15.2. Key Executives
13.15.3. Product & Services
13.16. Samsung Electronics Co. Ltd.
13.16.1. Business Overview
13.16.2. Key Executives
13.16.3. Product & Services
13.17. Shanghai Huahong Integrated Circuit Co., Ltd.
13.17.1. Business Overview
13.17.2. Key Executives
13.17.3. Product & Services
13.18. STMicroelectronics
13.18.1. Business Overview
13.18.2. Key Executives
13.18.3. Product & Services
13.19. Toshiba Corporation
13.19.1. Business Overview
13.19.2. Key Executives
13.19.3. Product & Services
13.20. Watchdata System Co. Ltd.
13.20.1. Business Overview
13.20.2. Key Executives
13.20.3. Product & Services
14. Appendix
14.1. Discussion Guide
14.2. License & Pricing