 | • レポートコード：MRC2303H059 • 出版社/出版日：360iResearch / 2022年10月11日 • レポート形態：英語、PDF、256ページ • 納品方法：Eメール（受注後2-3日） • 産業分類：IT |
| Single User（1名利用、印刷可） | ￥742,350 (USD4,949) | ▷ お問い合わせ |
| Enterprise License（企業利用、印刷可） | ￥1,492,350 (USD9,949) | ▷ お問い合わせ |
• お支払方法：銀行振込（納品後、ご請求書送付）
レポート概要
| 360iResearch社の当調査資料によると、2021年に198.2億ドルであった世界のWi-Fi 6E＆Wi-Fi 7チップセット市場規模は2022年に236.2億ドルとなり、2027年までに年平均19.45％成長して575.9億ドルまで拡大すると見込まれています。当書は、Wi-Fi 6E＆Wi-Fi 7チップセットの世界市場を対象とした調査・分析結果をまとめたものであり、序論、調査方法、エグゼクティブサマリー、市場概要、市場インサイト、種類別分析（Wi-Fi 6Eチップセット、Wi-Fi 7チップセット）、デバイスタイプ別分析（コネクテッドビークル、消費者用デバイス、ドローン、産業用IoTデバイス、ワイヤレスカメラ）、用途別分析（商業、政府＆防衛、エネルギー、住宅、スマートシティ）、地域別分析（南北アメリカ、アメリカ、カナダ、ブラジル、アジア太平洋、日本、中国、インド、韓国、台湾、ヨーロッパ/中東/アフリカ、イギリス、ドイツ、フランス、ロシア、その他）、競争状況、企業情報などの内容を掲載しています。なお、当書内の企業情報としては、Broadcom Inc、Celeno (Renesas Corporation)、Cypress Semiconductor Corporation、Intel Corporation、MediaTek Inc.、NXP Semiconductors N.V.、ON Semiconductor Connectivity Solutions, Inc.、Qualcomm Technologies, Inc.、Stmicroelectronics N.V.、Texas Instruments Incorporatedなどが含まれています。 ・序論 ・調査方法 ・エグゼクティブサマリー ・市場概要 ・市場インサイト ・世界のWi-Fi 6E＆Wi-Fi 7チップセット市場規模：種類別 - Wi-Fi 6Eチップセットの市場規模 - Wi-Fi 7チップセットの市場規模 ・世界のWi-Fi 6E＆Wi-Fi 7チップセット市場規模：デバイスタイプ別 コネクテッドビークルの市場規模 - 消費者用デバイスの市場規模 - ドローンの市場規模 - 産業用IoTデバイスの市場規模 - ワイヤレスカメラの市場規模 ・世界のWi-Fi 6E＆Wi-Fi 7チップセット市場規模：用途別 - 商業における市場規模 - 政府＆防衛における市場規模 - エネルギーにおける市場規模 - 住宅における市場規模 - スマートシティにおける市場規模 ・世界のWi-Fi 6E＆Wi-Fi 7チップセット市場規模：地域別 - 南北アメリカのWi-Fi 6E＆Wi-Fi 7チップセット市場規模 アメリカのWi-Fi 6E＆Wi-Fi 7チップセット市場規模 カナダのWi-Fi 6E＆Wi-Fi 7チップセット市場規模 ブラジルのWi-Fi 6E＆Wi-Fi 7チップセット市場規模 ... - アジア太平洋のWi-Fi 6E＆Wi-Fi 7チップセット市場規模 日本のWi-Fi 6E＆Wi-Fi 7チップセット市場規模 中国のWi-Fi 6E＆Wi-Fi 7チップセット市場規模 インドのWi-Fi 6E＆Wi-Fi 7チップセット市場規模 韓国のWi-Fi 6E＆Wi-Fi 7チップセット市場規模 台湾のWi-Fi 6E＆Wi-Fi 7チップセット市場規模 ... - ヨーロッパ/中東/アフリカのWi-Fi 6E＆Wi-Fi 7チップセット市場規模 イギリスのWi-Fi 6E＆Wi-Fi 7チップセット市場規模 ドイツのWi-Fi 6E＆Wi-Fi 7チップセット市場規模 フランスのWi-Fi 6E＆Wi-Fi 7チップセット市場規模 ロシアのWi-Fi 6E＆Wi-Fi 7チップセット市場規模 ... - その他地域のWi-Fi 6E＆Wi-Fi 7チップセット市場規模 ・競争状況 ・企業情報 |
The Global Wi-Fi 6E & Wi-Fi 7 Chipset Market size was estimated at USD 19.82 billion in 2021 and expected to reach USD 23.62 billion in 2022, and is projected to grow at a CAGR 19.45% to reach USD 57.59 billion by 2027.
Market Statistics:
The report provides market sizing and forecast across 7 major currencies – USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2020 are considered as historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered as the forecast period.
Market Segmentation & Coverage:
This research report categorizes the Wi-Fi 6E & Wi-Fi 7 Chipset to forecast the revenues and analyze the trends in each of the following sub-markets:
Based on Type, the market was studied across Wi-fi 6E and Wi-fi 7.
Based on Device Type, the market was studied across Connected Vehicles, Consumer Devices, Drones, Industrial IoT Devices, Wireless Cameras, and WLAN Infrastructure Devices. The Consumer Devices is further studied across AR/VR and Wearables, Desktops/Laptops, Smart Home Devices, and Smartphones/Tablets.
Based on Application, the market was studied across Commercial, Government & Defense, Industrial, Residential, Smart City, and Transportation & Logistics. The Commercial is further studied across Airports, Educational Campuses, Enterprises/Corporates, Hospitals, Hotels & Restaurants, Malls/Shops, and Stadiums. The Industrial is further studied across Energy & Utility, Oil & Gas and Mining, and Smart Manufacturing.
Based on Region, the market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.
Cumulative Impact of COVID-19:
COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.
Cumulative Impact of 2022 Russia Ukraine Conflict:
We continuously monitor and update reports on political and economic uncertainty due to the Russian invasion of Ukraine. Negative impacts are significantly foreseen globally, especially across Eastern Europe, European Union, Eastern & Central Asia, and the United States. This contention has severely affected lives and livelihoods and represents far-reaching disruptions in trade dynamics. The potential effects of ongoing war and uncertainty in Eastern Europe are expected to have an adverse impact on the world economy, with especially long-term harsh effects on Russia.This report uncovers the impact of demand & supply, pricing variants, strategic uptake of vendors, and recommendations for Wi-Fi 6E & Wi-Fi 7 Chipset market considering the current update on the conflict and its global response.
Competitive Strategic Window:
The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.
FPNV Positioning Matrix:
The FPNV Positioning Matrix evaluates and categorizes the vendors in the Wi-Fi 6E & Wi-Fi 7 Chipset Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.
Market Share Analysis:
The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.
Competitive Scenario:
The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.
Company Usability Profiles:
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global Wi-Fi 6E & Wi-Fi 7 Chipset Market, including Broadcom Inc, Celeno (Renesas Corporation), Cypress Semiconductor Corporation, Intel Corporation, MediaTek Inc., NXP Semiconductors N.V., ON Semiconductor Connectivity Solutions, Inc., Qualcomm Technologies, Inc., Stmicroelectronics N.V., and Texas Instruments Incorporated.
The report provides insights on the following pointers:
1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments
The report answers questions such as:
1. What is the market size and forecast of the Global Wi-Fi 6E & Wi-Fi 7 Chipset Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global Wi-Fi 6E & Wi-Fi 7 Chipset Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Wi-Fi 6E & Wi-Fi 7 Chipset Market?
4. What is the competitive strategic window for opportunities in the Global Wi-Fi 6E & Wi-Fi 7 Chipset Market?
5. What are the technology trends and regulatory frameworks in the Global Wi-Fi 6E & Wi-Fi 7 Chipset Market?
6. What is the market share of the leading vendors in the Global Wi-Fi 6E & Wi-Fi 7 Chipset Market?
7. What modes and strategic moves are considered suitable for entering the Global Wi-Fi 6E & Wi-Fi 7 Chipset Market?
1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Growing demand for high-bandwidth and low-latency telecommunications across enterprises
5.1.1.2. Increasing trends of e-learning techniques and WFH activities
5.1.1.3. Rapid adoption of smart factories and industrial IoT devices
5.1.2. Restraints
5.1.2.1. High installation costs and lack of proper infrastructure
5.1.3. Opportunities
5.1.3.1. Ongoing investments for smart city projects and smart homes
5.1.3.2. Technological advancements and software upgradation in Wi-Fi 6E & Wi-Fi 7 chipset
5.1.4. Challenges
5.1.4.1. Lack of awareness and provision of services in adverse climatic effects
5.2. Cumulative Impact of COVID-19
6. Wi-Fi 6E & Wi-Fi 7 Chipset Market, by Type
6.1. Introduction
6.2. Wi-fi 6E
6.3. Wi-fi 7
7. Wi-Fi 6E & Wi-Fi 7 Chipset Market, by Device Type
7.1. Introduction
7.2. Connected Vehicles
7.3. Consumer Devices
7.4.1. AR/VR and Wearables
7.4.2. Desktops/Laptops
7.4.3. Smart Home Devices
7.4.4. Smartphones/Tablets
7.4. Drones
7.5. Industrial IoT Devices
7.6. Wireless Cameras
7.7. WLAN Infrastructure Devices
8. Wi-Fi 6E & Wi-Fi 7 Chipset Market, by Application
8.1. Introduction
8.2. Commercial
8.3.1. Airports
8.3.2. Educational Campuses
8.3.3. Enterprises/Corporates
8.3.4. Hospitals
8.3.5. Hotels & Restaurants
8.3.6. Malls/Shops
8.3.7. Stadiums
8.3. Government & Defense
8.4. Industrial
8.5.1. Energy & Utility
8.5.2. Oil & Gas and Mining
8.5.3. Smart Manufacturing
8.5. Residential
8.6. Smart City
8.7. Transportation & Logistics
9. Americas Wi-Fi 6E & Wi-Fi 7 Chipset Market
9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States
10. Asia-Pacific Wi-Fi 6E & Wi-Fi 7 Chipset Market
10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam
11. Europe, Middle East & Africa Wi-Fi 6E & Wi-Fi 7 Chipset Market
11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom
12. Competitive Landscape
12.1. FPNV Positioning Matrix
12.1.1. Quadrants
12.1.2. Business Strategy
12.1.3. Product Satisfaction
12.2. Market Ranking Analysis, By Key Player
12.3. Market Share Analysis, By Key Player
12.4. Competitive Scenario
12.4.1. Merger & Acquisition
12.4.2. Agreement, Collaboration, & Partnership
12.4.3. New Product Launch & Enhancement
12.4.4. Investment & Funding
12.4.5. Award, Recognition, & Expansion
13. Company Usability Profiles
13.1. Broadcom Inc
13.1.1. Business Overview
13.1.2. Key Executives
13.1.3. Product & Services
13.2. Celeno (Renesas Corporation)
13.2.1. Business Overview
13.2.2. Key Executives
13.2.3. Product & Services
13.3. Cypress Semiconductor Corporation
13.3.1. Business Overview
13.3.2. Key Executives
13.3.3. Product & Services
13.4. Intel Corporation
13.4.1. Business Overview
13.4.2. Key Executives
13.4.3. Product & Services
13.5. MediaTek Inc.
13.5.1. Business Overview
13.5.2. Key Executives
13.5.3. Product & Services
13.6. NXP Semiconductors N.V.
13.6.1. Business Overview
13.6.2. Key Executives
13.6.3. Product & Services
13.7. ON Semiconductor Connectivity Solutions, Inc.
13.7.1. Business Overview
13.7.2. Key Executives
13.7.3. Product & Services
13.8. Qualcomm Technologies, Inc.
13.8.1. Business Overview
13.8.2. Key Executives
13.8.3. Product & Services
13.9. Stmicroelectronics N.V.
13.9.1. Business Overview
13.9.2. Key Executives
13.9.3. Product & Services
13.10. Texas Instruments Incorporated
13.10.1. Business Overview
13.10.2. Key Executives
13.10.3. Product & Services
14. Appendix
14.1. Discussion Guide
14.2. License & Pricing