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レポート概要
| 本調査レポートは世界のチップオンフィルムアンダーフィル（COF）市場について調査・分析し、世界のチップオンフィルムアンダーフィル（COF）市場概要、メーカー別競争状況、地域別生産量、地域別消費量、タイプ別セグメント分析（キャピラリーアンダーフィル（CUF）、ノーフローアンダーフィル（NUF）、非導電性ペースト（NCP）アンダーフィル、非導電性フィルム（NCF）アンダーフィル、成形アンダーフィル（MUF））、用途別セグメント分析（携帯電話、タブレット、液晶ディスプレイ、その他）、主要企業のプロファイル、市場動向などに関する情報を掲載しています。主要企業としては、Henkel、Won Chemical、LORD Corporation、Hanstars、Fuji Chemical、Panacol、Namics Corporation、Shenzhen Dover、Shin-Etsu Chemical、Bondline、Zymet、AIM Solder、MacDermid (Alpha Advanced Materials)、Darbond、AI Technology、Master Bondなどが含まれています。 世界のチップオンフィルムアンダーフィル（COF）市場は、2022年にXXX米ドル、2029年にはXXX米ドルに達すると予測され、予測期間中の年平均成長率はXXX％です。COVID-19とロシア・ウクライナ戦争による影響は、チップオンフィルムアンダーフィル（COF）市場規模を推定する際に考慮しました。本レポートは、チップオンフィルムアンダーフィル（COF）の世界市場を定量的・定性的な分析により包括的に提示し、読者がビジネス/成長戦略を策定し、市場競争状況を把握し、現在の市場における自社のポジションを分析し、チップオンフィルムアンダーフィル（COF）に関するビジネス上の意思決定に役立てることを目的としています。 ・チップオンフィルムアンダーフィル（COF）市場の概要 - 製品の定義 - チップオンフィルムアンダーフィル（COF）のタイプ別セグメント - 世界のチップオンフィルムアンダーフィル（COF）市場成長率のタイプ別分析（キャピラリーアンダーフィル（CUF）、ノーフローアンダーフィル（NUF）、非導電性ペースト（NCP）アンダーフィル、非導電性フィルム（NCF）アンダーフィル、成形アンダーフィル（MUF）） - チップオンフィルムアンダーフィル（COF）の用途別セグメント - 世界のチップオンフィルムアンダーフィル（COF）市場成長率の用途別分析（携帯電話、タブレット、液晶ディスプレイ、その他） - 世界市場の成長展望 - 世界のチップオンフィルムアンダーフィル（COF）生産量の推定と予測（2018年-2029年） - 世界のチップオンフィルムアンダーフィル（COF）生産能力の推定と予測（2018年-2029年） - チップオンフィルムアンダーフィル（COF）の平均価格の推定と予測（2018年-2029年） - 前提条件と制限事項 ・メーカー別競争状況 - メーカー別市場シェア - 世界の主要メーカー、業界ランキング分析 - メーカー別平均価格 - チップオンフィルムアンダーフィル（COF）市場の競争状況およびトレンド ・チップオンフィルムアンダーフィル（COF）の地域別生産量 - チップオンフィルムアンダーフィル（COF）生産量の地域別推計と予測（2018年-2029年） - 地域別チップオンフィルムアンダーフィル（COF）価格分析（2018年-2023年） - 北米のチップオンフィルムアンダーフィル（COF）生産規模（2018年-2029年） - ヨーロッパのチップオンフィルムアンダーフィル（COF）生産規模（2018年-2029年） - 中国のチップオンフィルムアンダーフィル（COF）生産規模（2018年-2029年） - 日本のチップオンフィルムアンダーフィル（COF）生産規模（2018年-2029年） - 韓国のチップオンフィルムアンダーフィル（COF）生産規模（2018年-2029年） - インドのチップオンフィルムアンダーフィル（COF）生産規模（2018年-2029年） ・チップオンフィルムアンダーフィル（COF）の地域別消費量 - チップオンフィルムアンダーフィル（COF）消費量の地域別推計と予測（2018年-2029年） - 北米のチップオンフィルムアンダーフィル（COF）消費量（2018年-2029年） - アメリカのチップオンフィルムアンダーフィル（COF）消費量（2018年-2029年） - ヨーロッパのチップオンフィルムアンダーフィル（COF）消費量（2018年-2029年） - アジア太平洋のチップオンフィルムアンダーフィル（COF）消費量（2018年-2029年） - 中国のチップオンフィルムアンダーフィル（COF）消費量（2018年-2029年） - 日本のチップオンフィルムアンダーフィル（COF）消費量（2018年-2029年） - 韓国のチップオンフィルムアンダーフィル（COF）消費量（2018年-2029年） - 東南アジアのチップオンフィルムアンダーフィル（COF）消費量（2018年-2029年） - インドのチップオンフィルムアンダーフィル（COF）消費量（2018年-2029年） - 中南米・中東・アフリカのチップオンフィルムアンダーフィル（COF）消費量（2018年-2029年） ・タイプ別セグメント：キャピラリーアンダーフィル（CUF）、ノーフローアンダーフィル（NUF）、非導電性ペースト（NCP）アンダーフィル、非導電性フィルム（NCF）アンダーフィル、成形アンダーフィル（MUF） - 世界のチップオンフィルムアンダーフィル（COF）のタイプ別生産量（2018年-2023年） - 世界のチップオンフィルムアンダーフィル（COF）のタイプ別生産量（2024年-2029年） - 世界のチップオンフィルムアンダーフィル（COF）のタイプ別価格 ・用途別セグメント：携帯電話、タブレット、液晶ディスプレイ、その他 - 世界のチップオンフィルムアンダーフィル（COF）の用途別生産量（2018年-2023年） - 世界のチップオンフィルムアンダーフィル（COF）の用途別生産量（2024年-2029年） - 世界のチップオンフィルムアンダーフィル（COF）の用途別価格 ・主要企業のプロファイル：企業情報、製品ポートフォリオ、生産量、価格、動向 Henkel、Won Chemical、LORD Corporation、Hanstars、Fuji Chemical、Panacol、Namics Corporation、Shenzhen Dover、Shin-Etsu Chemical、Bondline、Zymet、AIM Solder、MacDermid (Alpha Advanced Materials)、Darbond、AI Technology、Master Bond ・産業チェーンと販売チャネルの分析 - チップオンフィルムアンダーフィル（COF）産業チェーン分析 - チップオンフィルムアンダーフィル（COF）の主要原材料 - チップオンフィルムアンダーフィル（COF）の販売チャネル - チップオンフィルムアンダーフィル（COF）のディストリビューター - チップオンフィルムアンダーフィル（COF）の主要顧客 ・チップオンフィルムアンダーフィル（COF）市場ダイナミクス - チップオンフィルムアンダーフィル（COF）の業界動向 - チップオンフィルムアンダーフィル（COF）市場の成長ドライバ、課題、阻害要因 ・調査成果および結論 ・調査方法とデータソース |
Underfills serve the purpose of equalizing stresses between chip and substrate. Chips are attached directly to the interconnection points without intermediate elements. Stresses arise at the solder bumps when the electronic modules are heated and cooled during operation due to the different coefficients of thermal expansion of the substrates. Underfill technology was developed to counteract these mechanical influences. The Chip On Film Underfill (COF) market covers Capillary Underfill (CUF), No Flow Underfill (NUF), Non-Conductive Paste (NCP) Underfill, Non-Conductive Film (NCF) Underfill, Molded Underfill (MUF) Underfill, etc. The typical players include Namics Corporation, AI Technology, Henkel, Shenzhen Dover, Darbond, LORD Corporation, Panacol, Won Chemical, etc.
Highlights
The global Chip On Film Underfill (COF) market was valued at US$ 360.9 million in 2022 and is anticipated to reach US$ 454.2 million by 2029, witnessing a CAGR of 3.3% during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global Chip On Film Underfill (COF) includes Henkel, Won Chemical, etc. Global top 2 companies hold a share over 43.19%. Asia-Pacific is the largest market, with a share about 49.18%, followed by North America and Europe with the share about 24.91% and 18.09%.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Chip On Film Underfill (COF), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip On Film Underfill (COF).
The Chip On Film Underfill (COF) market size, estimations, and forecasts are provided in terms of output/shipments (MT) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Chip On Film Underfill (COF) market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Chip On Film Underfill (COF) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Henkel
Won Chemical
LORD Corporation
Hanstars
Fuji Chemical
Panacol
Namics Corporation
Shenzhen Dover
Shin-Etsu Chemical
Bondline
Zymet
AIM Solder
MacDermid (Alpha Advanced Materials)
Darbond
AI Technology
Master Bond
Segment by Type
Capillary Underfill (CUF)
No Flow Underfill (NUF)
Non-Conductive Paste (NCP) Underfill
Non-Conductive Film (NCF) Underfill
Molded Underfill (MUF) Underfill
Segment by Application
Cell Phone
Tablet
LCD Display
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Colombia
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Chip On Film Underfill (COF) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Chip On Film Underfill (COF) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Chip On Film Underfill (COF) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
1 Chip On Film Underfill (COF) Market Overview
1.1 Product Definition
1.2 Chip On Film Underfill (COF) Segment by Type
1.2.1 Global Chip On Film Underfill (COF) Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Capillary Underfill (CUF)
1.2.3 No Flow Underfill (NUF)
1.2.4 Non-Conductive Paste (NCP) Underfill
1.2.5 Non-Conductive Film (NCF) Underfill
1.2.6 Molded Underfill (MUF) Underfill
1.3 Chip On Film Underfill (COF) Segment by Application
1.3.1 Global Chip On Film Underfill (COF) Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Cell Phone
1.3.3 Tablet
1.3.4 LCD Display
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Chip On Film Underfill (COF) Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Chip On Film Underfill (COF) Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Chip On Film Underfill (COF) Production Estimates and Forecasts (2018-2029)
1.4.4 Global Chip On Film Underfill (COF) Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Chip On Film Underfill (COF) Production Market Share by Manufacturers (2018-2023)
2.2 Global Chip On Film Underfill (COF) Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Chip On Film Underfill (COF), Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Chip On Film Underfill (COF) Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Chip On Film Underfill (COF) Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Chip On Film Underfill (COF), Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Chip On Film Underfill (COF), Product Offered and Application
2.8 Global Key Manufacturers of Chip On Film Underfill (COF), Date of Enter into This Industry
2.9 Chip On Film Underfill (COF) Market Competitive Situation and Trends
2.9.1 Chip On Film Underfill (COF) Market Concentration Rate
2.9.2 Global 5 and 10 Largest Chip On Film Underfill (COF) Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Chip On Film Underfill (COF) Production by Region
3.1 Global Chip On Film Underfill (COF) Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Chip On Film Underfill (COF) Production Value by Region (2018-2029)
3.2.1 Global Chip On Film Underfill (COF) Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Chip On Film Underfill (COF) by Region (2024-2029)
3.3 Global Chip On Film Underfill (COF) Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Chip On Film Underfill (COF) Production by Region (2018-2029)
3.4.1 Global Chip On Film Underfill (COF) Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Chip On Film Underfill (COF) by Region (2024-2029)
3.5 Global Chip On Film Underfill (COF) Market Price Analysis by Region (2018-2023)
3.6 Global Chip On Film Underfill (COF) Production and Value, Year-over-Year Growth
3.6.1 North America Chip On Film Underfill (COF) Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Chip On Film Underfill (COF) Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Chip On Film Underfill (COF) Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Chip On Film Underfill (COF) Production Value Estimates and Forecasts (2018-2029)
4 Chip On Film Underfill (COF) Consumption by Region
4.1 Global Chip On Film Underfill (COF) Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Chip On Film Underfill (COF) Consumption by Region (2018-2029)
4.2.1 Global Chip On Film Underfill (COF) Consumption by Region (2018-2023)
4.2.2 Global Chip On Film Underfill (COF) Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Chip On Film Underfill (COF) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Chip On Film Underfill (COF) Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Chip On Film Underfill (COF) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Chip On Film Underfill (COF) Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Chip On Film Underfill (COF) Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Chip On Film Underfill (COF) Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Chip On Film Underfill (COF) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Chip On Film Underfill (COF) Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Chip On Film Underfill (COF) Production by Type (2018-2029)
5.1.1 Global Chip On Film Underfill (COF) Production by Type (2018-2023)
5.1.2 Global Chip On Film Underfill (COF) Production by Type (2024-2029)
5.1.3 Global Chip On Film Underfill (COF) Production Market Share by Type (2018-2029)
5.2 Global Chip On Film Underfill (COF) Production Value by Type (2018-2029)
5.2.1 Global Chip On Film Underfill (COF) Production Value by Type (2018-2023)
5.2.2 Global Chip On Film Underfill (COF) Production Value by Type (2024-2029)
5.2.3 Global Chip On Film Underfill (COF) Production Value Market Share by Type (2018-2029)
5.3 Global Chip On Film Underfill (COF) Price by Type (2018-2029)
6 Segment by Application
6.1 Global Chip On Film Underfill (COF) Production by Application (2018-2029)
6.1.1 Global Chip On Film Underfill (COF) Production by Application (2018-2023)
6.1.2 Global Chip On Film Underfill (COF) Production by Application (2024-2029)
6.1.3 Global Chip On Film Underfill (COF) Production Market Share by Application (2018-2029)
6.2 Global Chip On Film Underfill (COF) Production Value by Application (2018-2029)
6.2.1 Global Chip On Film Underfill (COF) Production Value by Application (2018-2023)
6.2.2 Global Chip On Film Underfill (COF) Production Value by Application (2024-2029)
6.2.3 Global Chip On Film Underfill (COF) Production Value Market Share by Application (2018-2029)
6.3 Global Chip On Film Underfill (COF) Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Henkel
7.1.1 Henkel Chip On Film Underfill (COF) Corporation Information
7.1.2 Henkel Chip On Film Underfill (COF) Product Portfolio
7.1.3 Henkel Chip On Film Underfill (COF) Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Henkel Main Business and Markets Served
7.1.5 Henkel Recent Developments/Updates
7.2 Won Chemical
7.2.1 Won Chemical Chip On Film Underfill (COF) Corporation Information
7.2.2 Won Chemical Chip On Film Underfill (COF) Product Portfolio
7.2.3 Won Chemical Chip On Film Underfill (COF) Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Won Chemical Main Business and Markets Served
7.2.5 Won Chemical Recent Developments/Updates
7.3 LORD Corporation
7.3.1 LORD Corporation Chip On Film Underfill (COF) Corporation Information
7.3.2 LORD Corporation Chip On Film Underfill (COF) Product Portfolio
7.3.3 LORD Corporation Chip On Film Underfill (COF) Production, Value, Price and Gross Margin (2018-2023)
7.3.4 LORD Corporation Main Business and Markets Served
7.3.5 LORD Corporation Recent Developments/Updates
7.4 Hanstars
7.4.1 Hanstars Chip On Film Underfill (COF) Corporation Information
7.4.2 Hanstars Chip On Film Underfill (COF) Product Portfolio
7.4.3 Hanstars Chip On Film Underfill (COF) Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Hanstars Main Business and Markets Served
7.4.5 Hanstars Recent Developments/Updates
7.5 Fuji Chemical
7.5.1 Fuji Chemical Chip On Film Underfill (COF) Corporation Information
7.5.2 Fuji Chemical Chip On Film Underfill (COF) Product Portfolio
7.5.3 Fuji Chemical Chip On Film Underfill (COF) Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Fuji Chemical Main Business and Markets Served
7.5.5 Fuji Chemical Recent Developments/Updates
7.6 Panacol
7.6.1 Panacol Chip On Film Underfill (COF) Corporation Information
7.6.2 Panacol Chip On Film Underfill (COF) Product Portfolio
7.6.3 Panacol Chip On Film Underfill (COF) Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Panacol Main Business and Markets Served
7.6.5 Panacol Recent Developments/Updates
7.7 Namics Corporation
7.7.1 Namics Corporation Chip On Film Underfill (COF) Corporation Information
7.7.2 Namics Corporation Chip On Film Underfill (COF) Product Portfolio
7.7.3 Namics Corporation Chip On Film Underfill (COF) Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Namics Corporation Main Business and Markets Served
7.7.5 Namics Corporation Recent Developments/Updates
7.8 Shenzhen Dover
7.8.1 Shenzhen Dover Chip On Film Underfill (COF) Corporation Information
7.8.2 Shenzhen Dover Chip On Film Underfill (COF) Product Portfolio
7.8.3 Shenzhen Dover Chip On Film Underfill (COF) Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Shenzhen Dover Main Business and Markets Served
7.7.5 Shenzhen Dover Recent Developments/Updates
7.9 Shin-Etsu Chemical
7.9.1 Shin-Etsu Chemical Chip On Film Underfill (COF) Corporation Information
7.9.2 Shin-Etsu Chemical Chip On Film Underfill (COF) Product Portfolio
7.9.3 Shin-Etsu Chemical Chip On Film Underfill (COF) Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Shin-Etsu Chemical Main Business and Markets Served
7.9.5 Shin-Etsu Chemical Recent Developments/Updates
7.10 Bondline
7.10.1 Bondline Chip On Film Underfill (COF) Corporation Information
7.10.2 Bondline Chip On Film Underfill (COF) Product Portfolio
7.10.3 Bondline Chip On Film Underfill (COF) Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Bondline Main Business and Markets Served
7.10.5 Bondline Recent Developments/Updates
7.11 Zymet
7.11.1 Zymet Chip On Film Underfill (COF) Corporation Information
7.11.2 Zymet Chip On Film Underfill (COF) Product Portfolio
7.11.3 Zymet Chip On Film Underfill (COF) Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Zymet Main Business and Markets Served
7.11.5 Zymet Recent Developments/Updates
7.12 AIM Solder
7.12.1 AIM Solder Chip On Film Underfill (COF) Corporation Information
7.12.2 AIM Solder Chip On Film Underfill (COF) Product Portfolio
7.12.3 AIM Solder Chip On Film Underfill (COF) Production, Value, Price and Gross Margin (2018-2023)
7.12.4 AIM Solder Main Business and Markets Served
7.12.5 AIM Solder Recent Developments/Updates
7.13 MacDermid (Alpha Advanced Materials)
7.13.1 MacDermid (Alpha Advanced Materials) Chip On Film Underfill (COF) Corporation Information
7.13.2 MacDermid (Alpha Advanced Materials) Chip On Film Underfill (COF) Product Portfolio
7.13.3 MacDermid (Alpha Advanced Materials) Chip On Film Underfill (COF) Production, Value, Price and Gross Margin (2018-2023)
7.13.4 MacDermid (Alpha Advanced Materials) Main Business and Markets Served
7.13.5 MacDermid (Alpha Advanced Materials) Recent Developments/Updates
7.14 Darbond
7.14.1 Darbond Chip On Film Underfill (COF) Corporation Information
7.14.2 Darbond Chip On Film Underfill (COF) Product Portfolio
7.14.3 Darbond Chip On Film Underfill (COF) Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Darbond Main Business and Markets Served
7.14.5 Darbond Recent Developments/Updates
7.15 AI Technology
7.15.1 AI Technology Chip On Film Underfill (COF) Corporation Information
7.15.2 AI Technology Chip On Film Underfill (COF) Product Portfolio
7.15.3 AI Technology Chip On Film Underfill (COF) Production, Value, Price and Gross Margin (2018-2023)
7.15.4 AI Technology Main Business and Markets Served
7.15.5 AI Technology Recent Developments/Updates
7.16 Master Bond
7.16.1 Master Bond Chip On Film Underfill (COF) Corporation Information
7.16.2 Master Bond Chip On Film Underfill (COF) Product Portfolio
7.16.3 Master Bond Chip On Film Underfill (COF) Production, Value, Price and Gross Margin (2018-2023)
7.16.4 Master Bond Main Business and Markets Served
7.16.5 Master Bond Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Chip On Film Underfill (COF) Industry Chain Analysis
8.2 Chip On Film Underfill (COF) Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Chip On Film Underfill (COF) Production Mode & Process
8.4 Chip On Film Underfill (COF) Sales and Marketing
8.4.1 Chip On Film Underfill (COF) Sales Channels
8.4.2 Chip On Film Underfill (COF) Distributors
8.5 Chip On Film Underfill (COF) Customers
9 Chip On Film Underfill (COF) Market Dynamics
9.1 Chip On Film Underfill (COF) Industry Trends
9.2 Chip On Film Underfill (COF) Market Drivers
9.3 Chip On Film Underfill (COF) Market Challenges
9.4 Chip On Film Underfill (COF) Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer