 | • レポートコード：MRC23Q35995 • 出版社/出版日：QYResearch / 2023年3月 • レポート形態：英文、PDF、85ページ • 納品方法：Eメール（2-3日） • 産業分類：電子＆半導体 |
| Single User | ￥406,000 (USD2,900) | ▷ お問い合わせ |
| Enterprise License | ￥812,000 (USD5,800) | ▷ お問い合わせ |
• お支払方法：銀行振込（納品後、ご請求書送付）
レポート概要
| 本調査レポートは世界のファンアウトウェーハレベルパッケージング市場について調査・分析し、世界のファンアウトウェーハレベルパッケージング市場概要、市場トレンド、主要企業別競争状況、タイプ別セグメント分析（200mmウェーハ、300mmウェーハ、450mmウェーハ、その他）、用途別セグメント分析（電子＆半導体、通信工学、その他）、地域別市場規模、主要企業のプロファイルなどに関する情報を掲載しています。主要企業としては、ASE、Amkor Technology、Deca Technology、Huatian Technology、Infineon、JCAP、Nepes、Spil、Stats ChipPAC、TSMC、Freescale、NANIUM、Taiwan Semiconductor Manufacturingなどが含まれています。 世界のファンアウトウェーハレベルパッケージング市場は、2022年にXXX米ドル、2029年にはXXX米ドルに達すると予測され、予測期間の年平均成長率はXXX％です。COVID-19とロシア・ウクライナ戦争の影響は、ファンアウトウェーハレベルパッケージング市場規模を推定する際に考慮しました。本レポートは、ファンアウトウェーハレベルパッケージングの世界市場を定量的・定性的な分析により包括的に提示し、読者がビジネス/成長戦略を策定し、市場競争状況を把握し、現在の市場における自社のポジションを分析し、ファンアウトウェーハレベルパッケージングに関するビジネス上の意思決定に役立てることを目的としています。 ・ファンアウトウェーハレベルパッケージング市場の概要 - ファンアウトウェーハレベルパッケージングのタイプ別セグメント - 世界のファンアウトウェーハレベルパッケージング市場規模：タイプ別分析（200mmウェーハ、300mmウェーハ、450mmウェーハ、その他） - ファンアウトウェーハレベルパッケージングの用途別セグメント - 世界のファンアウトウェーハレベルパッケージング市場規模：用途別分析（電子＆半導体、通信工学、その他） - 世界のファンアウトウェーハレベルパッケージング市場規模予測（2018年-2029年） ・ファンアウトウェーハレベルパッケージング市場の成長トレンド - ファンアウトウェーハレベルパッケージングの地域別市場規模（2018年-2029年） - ファンアウトウェーハレベルパッケージング市場ダイナミクス - ファンアウトウェーハレベルパッケージングの業界動向 - ファンアウトウェーハレベルパッケージング市場の成長ドライバ、課題、阻害要因 ・主要企業別競争状況 - 企業別市場シェア - 世界の主要企業、業界ランキング分析 - 市場への参入、M＆A動向 ・タイプ別セグメント：200mmウェーハ、300mmウェーハ、450mmウェーハ、その他 - 世界のファンアウトウェーハレベルパッケージングのタイプ別市場規模（2018年-2023年） - 世界のファンアウトウェーハレベルパッケージングのタイプ別市場規模（2024年-2029年） ・用途別セグメント：電子＆半導体、通信工学、その他 - 世界のファンアウトウェーハレベルパッケージングの用途別市場規模（2018年-2023年） - 世界のファンアウトウェーハレベルパッケージングの用途別市場規模（2024年-2029年） ・ファンアウトウェーハレベルパッケージングの地域別市場規模 - 北米のファンアウトウェーハレベルパッケージング市場規模（2018年-2029年） - アメリカのファンアウトウェーハレベルパッケージング市場規模（2018年-2029年） - ヨーロッパのファンアウトウェーハレベルパッケージング市場規模（2018年-2029年） - アジア太平洋のファンアウトウェーハレベルパッケージング市場規模（2018年-2029年） - 中国のファンアウトウェーハレベルパッケージング市場規模（2018年-2029年） - 日本のファンアウトウェーハレベルパッケージング市場規模（2018年-2029年） - 韓国のファンアウトウェーハレベルパッケージング市場規模（2018年-2029年） - インドのファンアウトウェーハレベルパッケージング市場規模（2018年-2029年） - オーストラリアのファンアウトウェーハレベルパッケージング市場規模（2018年-2029年） - 中南米のファンアウトウェーハレベルパッケージング市場規模（2018年-2029年） - 中東・アフリカのファンアウトウェーハレベルパッケージング市場規模（2018年-2029年） ・主要企業のプロファイル：企業情報、事業概要、売上、動向 ASE、Amkor Technology、Deca Technology、Huatian Technology、Infineon、JCAP、Nepes、Spil、Stats ChipPAC、TSMC、Freescale、NANIUM、Taiwan Semiconductor Manufacturing ・アナリストの観点/結論 ・調査方法とデータソース |
Fan-out wafer-level packaging is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions.
Highlights
The global Fan-out Wafer Level Package market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Fan-out Wafer Level Package is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Fan-out Wafer Level Package is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The global market for Fan-out Wafer Level Package in Electronics & Semiconductor is estimated to increase from $ million in 2023 to $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Fan-out Wafer Level Package include ASE, Amkor Technology, Deca Technology, Huatian Technology, Infineon, JCAP, Nepes, Spil and Stats ChipPAC, etc. In 2022, the world’s top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Fan-out Wafer Level Package, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Fan-out Wafer Level Package.
The Fan-out Wafer Level Package market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Fan-out Wafer Level Package market comprehensively. Regional market sizes, concerning products by type, by application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Fan-out Wafer Level Package companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
ASE
Amkor Technology
Deca Technology
Huatian Technology
Infineon
JCAP
Nepes
Spil
Stats ChipPAC
TSMC
Freescale
NANIUM
Taiwan Semiconductor Manufacturing
Segment by Type
200mm Wafers
300mm Wafers
450mm Wafers
Others
Segment by Application
Electronics & Semiconductor
Communication Engineering
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Fan-out Wafer Level Package companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Fan-out Wafer Level Package Market Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 200mm Wafers
1.2.3 300mm Wafers
1.2.4 450mm Wafers
1.2.5 Others
1.3 Market by Application
1.3.1 Global Fan-out Wafer Level Package Market Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Electronics & Semiconductor
1.3.3 Communication Engineering
1.3.4 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Fan-out Wafer Level Package Market Perspective (2018-2029)
2.2 Fan-out Wafer Level Package Growth Trends by Region
2.2.1 Global Fan-out Wafer Level Package Market Size by Region: 2018 VS 2022 VS 2029
2.2.2 Fan-out Wafer Level Package Historic Market Size by Region (2018-2023)
2.2.3 Fan-out Wafer Level Package Forecasted Market Size by Region (2024-2029)
2.3 Fan-out Wafer Level Package Market Dynamics
2.3.1 Fan-out Wafer Level Package Industry Trends
2.3.2 Fan-out Wafer Level Package Market Drivers
2.3.3 Fan-out Wafer Level Package Market Challenges
2.3.4 Fan-out Wafer Level Package Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Fan-out Wafer Level Package Players by Revenue
3.1.1 Global Top Fan-out Wafer Level Package Players by Revenue (2018-2023)
3.1.2 Global Fan-out Wafer Level Package Revenue Market Share by Players (2018-2023)
3.2 Global Fan-out Wafer Level Package Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Fan-out Wafer Level Package Revenue
3.4 Global Fan-out Wafer Level Package Market Concentration Ratio
3.4.1 Global Fan-out Wafer Level Package Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Fan-out Wafer Level Package Revenue in 2022
3.5 Fan-out Wafer Level Package Key Players Head office and Area Served
3.6 Key Players Fan-out Wafer Level Package Product Solution and Service
3.7 Date of Enter into Fan-out Wafer Level Package Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Fan-out Wafer Level Package Breakdown Data by Type
4.1 Global Fan-out Wafer Level Package Historic Market Size by Type (2018-2023)
4.2 Global Fan-out Wafer Level Package Forecasted Market Size by Type (2024-2029)
5 Fan-out Wafer Level Package Breakdown Data by Application
5.1 Global Fan-out Wafer Level Package Historic Market Size by Application (2018-2023)
5.2 Global Fan-out Wafer Level Package Forecasted Market Size by Application (2024-2029)
6 North America
6.1 North America Fan-out Wafer Level Package Market Size (2018-2029)
6.2 North America Fan-out Wafer Level Package Market Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America Fan-out Wafer Level Package Market Size by Country (2018-2023)
6.4 North America Fan-out Wafer Level Package Market Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Fan-out Wafer Level Package Market Size (2018-2029)
7.2 Europe Fan-out Wafer Level Package Market Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe Fan-out Wafer Level Package Market Size by Country (2018-2023)
7.4 Europe Fan-out Wafer Level Package Market Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Fan-out Wafer Level Package Market Size (2018-2029)
8.2 Asia-Pacific Fan-out Wafer Level Package Market Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific Fan-out Wafer Level Package Market Size by Region (2018-2023)
8.4 Asia-Pacific Fan-out Wafer Level Package Market Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Fan-out Wafer Level Package Market Size (2018-2029)
9.2 Latin America Fan-out Wafer Level Package Market Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America Fan-out Wafer Level Package Market Size by Country (2018-2023)
9.4 Latin America Fan-out Wafer Level Package Market Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Fan-out Wafer Level Package Market Size (2018-2029)
10.2 Middle East & Africa Fan-out Wafer Level Package Market Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa Fan-out Wafer Level Package Market Size by Country (2018-2023)
10.4 Middle East & Africa Fan-out Wafer Level Package Market Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE
11.1.1 ASE Company Detail
11.1.2 ASE Business Overview
11.1.3 ASE Fan-out Wafer Level Package Introduction
11.1.4 ASE Revenue in Fan-out Wafer Level Package Business (2018-2023)
11.1.5 ASE Recent Development
11.2 Amkor Technology
11.2.1 Amkor Technology Company Detail
11.2.2 Amkor Technology Business Overview
11.2.3 Amkor Technology Fan-out Wafer Level Package Introduction
11.2.4 Amkor Technology Revenue in Fan-out Wafer Level Package Business (2018-2023)
11.2.5 Amkor Technology Recent Development
11.3 Deca Technology
11.3.1 Deca Technology Company Detail
11.3.2 Deca Technology Business Overview
11.3.3 Deca Technology Fan-out Wafer Level Package Introduction
11.3.4 Deca Technology Revenue in Fan-out Wafer Level Package Business (2018-2023)
11.3.5 Deca Technology Recent Development
11.4 Huatian Technology
11.4.1 Huatian Technology Company Detail
11.4.2 Huatian Technology Business Overview
11.4.3 Huatian Technology Fan-out Wafer Level Package Introduction
11.4.4 Huatian Technology Revenue in Fan-out Wafer Level Package Business (2018-2023)
11.4.5 Huatian Technology Recent Development
11.5 Infineon
11.5.1 Infineon Company Detail
11.5.2 Infineon Business Overview
11.5.3 Infineon Fan-out Wafer Level Package Introduction
11.5.4 Infineon Revenue in Fan-out Wafer Level Package Business (2018-2023)
11.5.5 Infineon Recent Development
11.6 JCAP
11.6.1 JCAP Company Detail
11.6.2 JCAP Business Overview
11.6.3 JCAP Fan-out Wafer Level Package Introduction
11.6.4 JCAP Revenue in Fan-out Wafer Level Package Business (2018-2023)
11.6.5 JCAP Recent Development
11.7 Nepes
11.7.1 Nepes Company Detail
11.7.2 Nepes Business Overview
11.7.3 Nepes Fan-out Wafer Level Package Introduction
11.7.4 Nepes Revenue in Fan-out Wafer Level Package Business (2018-2023)
11.7.5 Nepes Recent Development
11.8 Spil
11.8.1 Spil Company Detail
11.8.2 Spil Business Overview
11.8.3 Spil Fan-out Wafer Level Package Introduction
11.8.4 Spil Revenue in Fan-out Wafer Level Package Business (2018-2023)
11.8.5 Spil Recent Development
11.9 Stats ChipPAC
11.9.1 Stats ChipPAC Company Detail
11.9.2 Stats ChipPAC Business Overview
11.9.3 Stats ChipPAC Fan-out Wafer Level Package Introduction
11.9.4 Stats ChipPAC Revenue in Fan-out Wafer Level Package Business (2018-2023)
11.9.5 Stats ChipPAC Recent Development
11.10 TSMC
11.10.1 TSMC Company Detail
11.10.2 TSMC Business Overview
11.10.3 TSMC Fan-out Wafer Level Package Introduction
11.10.4 TSMC Revenue in Fan-out Wafer Level Package Business (2018-2023)
11.10.5 TSMC Recent Development
11.11 Freescale
11.11.1 Freescale Company Detail
11.11.2 Freescale Business Overview
11.11.3 Freescale Fan-out Wafer Level Package Introduction
11.11.4 Freescale Revenue in Fan-out Wafer Level Package Business (2018-2023)
11.11.5 Freescale Recent Development
11.12 NANIUM
11.12.1 NANIUM Company Detail
11.12.2 NANIUM Business Overview
11.12.3 NANIUM Fan-out Wafer Level Package Introduction
11.12.4 NANIUM Revenue in Fan-out Wafer Level Package Business (2018-2023)
11.12.5 NANIUM Recent Development
11.13 Taiwan Semiconductor Manufacturing
11.13.1 Taiwan Semiconductor Manufacturing Company Detail
11.13.2 Taiwan Semiconductor Manufacturing Business Overview
11.13.3 Taiwan Semiconductor Manufacturing Fan-out Wafer Level Package Introduction
11.13.4 Taiwan Semiconductor Manufacturing Revenue in Fan-out Wafer Level Package Business (2018-2023)
11.13.5 Taiwan Semiconductor Manufacturing Recent Development
12 Analyst’s Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details